MT48H16M16LFBF-75:H Micron Technology Inc, MT48H16M16LFBF-75:H Datasheet - Page 22

SDRAM 256M-BIT 1.8V 54-PIN VFBGA

MT48H16M16LFBF-75:H

Manufacturer Part Number
MT48H16M16LFBF-75:H
Description
SDRAM 256M-BIT 1.8V 54-PIN VFBGA
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48H16M16LFBF-75:H

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
256M (16Mx16)
Speed
132MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
8/6ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
80mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q4707290

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PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
10. For auto precharge mode, the precharge timing budget (
11. CLK must be toggled a minimum of two times during this period.
12. Required clocks are specified by JEDEC functionality and are not dependent on any tim-
13. Timing is specified by
14. Timing is specified by
15. Timing is specified by
16. Based on
ns reduction in slew rate. Input hold times remain unchanged. If the slew rate exceeds
4.5V/ns, functionality is uncertain.
after the first clock delay and after the last WRITE is executed.
ing parameter.
cycle rate.
t
CK (MIN), CL = 3.
Electrical Specifications – AC Operating Conditions
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
t
t
t
CKS. Clock(s) specified as a reference only at minimum cycle rate.
WR plus
WR.
22
t
RP. Clock(s) specified as a reference only at minimum
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
RP) begins at
©2008 Micron Technology, Inc. All rights reserved.
t
RP – (1 ×
t
CKns),

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