MAX1785EVKIT# Maxim Integrated, MAX1785EVKIT# Datasheet - Page 3
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MAX1785EVKIT#
Manufacturer Part Number
MAX1785EVKIT#
Description
Power Management IC Development Tools Evaluation kit for MAX1785
Manufacturer
Maxim Integrated
Datasheet
1.MAX1785EVKIT.pdf
(5 pages)
II. Manufacturing Information
III. Packaging Information
IV. Die Information
Maxim Integrated Products. All rights reserved.
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
Smart Battery-Pack Controller
S4
Texas
ATP Philippines
July 28, 2007
38-pin TSSOP
Copper
100% matte Tin
Conductive Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
#05-9000-2483
Class UL94-V0
Level 3
73°C/W
11°C/W
62.5°C/W
11°C/W
108 X 238 mils
Si
Aluminum/Si (Si = 1%)
None
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide
MAX1785EUU+
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