MT48V8M16LFB4-8:G Micron Technology Inc, MT48V8M16LFB4-8:G Datasheet - Page 53

IC SDRAM 128MBIT 125MHZ 54VFBGA

MT48V8M16LFB4-8:G

Manufacturer Part Number
MT48V8M16LFB4-8:G
Description
IC SDRAM 128MBIT 125MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr

Specifications of MT48V8M16LFB4-8:G

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
128M (8Mx16)
Speed
125MHz
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
19/8/7ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
2.5V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
100mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48V8M16LFB4-8:G
Manufacturer:
MICRON
Quantity:
4 000
Part Number:
MT48V8M16LFB4-8:G
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48V8M16LFB4-8:G TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Table 17:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
Ac Characteristics
Parameter
Access time from CLK (positive
edge)
Address hold time
Address setup time
CLK high-level width
CLK low-level width
Clock cycle time
CKE hold time
CKE setup time
CS#, RAS#, CAS#, WE#, DQM hold time
CS#, RAS#, CAS#, WE#, DQM setup time
Data-in hold time
Data-in setup time
Data-out High-Z time
Data-out Low-Z time
Data-out hold time (load)
Data-out hold time (no load)
ACTIVE-to-PRECHARGE command
ACTIVE-to-ACTIVE command period
ACTIVE-to-READ or WRITE delay
Refresh period (4,096 rows)
Refresh period – (AT) (4,096 rows)
AUTO REFRESH command period
PRECHARGE command period
ACTIVE bank a to ACTIVE bank b command
Transition time
WRITE recovery time
Auto precharge mode (a)
Manual precharge mode (m)
Exit SELF REFRESH to ACTIVE command
Electrical Characteristics and Recommended AC Operating Conditions
Notes 5, 6, 7, 8, 9, 11 apply to entire table; notes appear on page 57
CL = 3
CL = 2
CL = 1
CL = 3
CL = 2
CL = 1
CL = 3
CL = 2
CL = 1
Symbol
t
t
t
t
t
WR (m)
t
t
t
t
t
t
t
WR (a)
AC (3)
AC (2)
AC (1)
t
CK (3)
CK (2)
CK (1)
t
HZ (3)
HZ (2)
HZ (1)
t
t
t
REF
t
t
t
t
t
t
CMH
t
CMS
t
t
OH
t
CKH
RCD
RRD
t
CKS
t
RAS
t
t
XSR
t
t
REF
RFC
AH
DH
OH
CH
AS
DS
RC
RP
t
CL
LZ
T
AT
N
+7.5ns
1 CLK
Min
n/a
0.8
1.5
2.5
7.5
9.6
2.5
0.8
1.5
0.8
1.5
2.5
1.8
0.3
44
66
19
66
19
15
67
3
1
1
2
-75M
53
120,000
Max
5.4
5.4
1.2
na
na
64
16
6
6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1 CLK
+7ns
Min
2.5
9.6
2.5
2.5
2.5
2.5
1.8
0.5
20
48
80
20
80
20
15
80
1
3
3
8
1
1
1
1
2
128Mb: x16, x32 Mobile SDRAM
-8
120,000
Max
1.2
19
19
64
16
7
7
8
8
Electrical Specifications
1 CLK
+5ns
Min
100
100
100
2.5
2.5
2.5
2.5
2.5
1.8
0.5
10
12
25
50
20
20
15
1
3
3
1
1
1
1
2
©2001 Micron Technology, Inc. All rights reserved.
-10
120,000
Max
1.2
22
22
64
16
7
8
7
8
Units
t
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CK
Notes
23
23
23
10
10
10
27
24
25
20
7

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