MT48V8M16LFB4-8:G Micron Technology Inc, MT48V8M16LFB4-8:G Datasheet - Page 55

IC SDRAM 128MBIT 125MHZ 54VFBGA

MT48V8M16LFB4-8:G

Manufacturer Part Number
MT48V8M16LFB4-8:G
Description
IC SDRAM 128MBIT 125MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr

Specifications of MT48V8M16LFB4-8:G

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
128M (8Mx16)
Speed
125MHz
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
19/8/7ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
2.5V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
100mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48V8M16LFB4-8:G
Manufacturer:
MICRON
Quantity:
4 000
Part Number:
MT48V8M16LFB4-8:G
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48V8M16LFB4-8:G TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Table 19:
Table 20:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
Parameter/Condition
Operating current: Active mode; Burst = 2; READ or WRITE;
t
Standby current: Power-down mode; All banks idle;
CKE = LOW
Standby current: Active mode; CKE = HIGH; CS# = HIGH; All
banks active after
Operating current: Burst mode; Page burst; READ or WRITE;
All banks active
Auto refresh current: CKE = HIGH;
CS# = HIGH
Temperature-Compensated Self Refresh (TCSR)
Parameter/Condition
Self refresh current: CKE < 0.2V (E4 = 1, E3 = 1)
Self refresh current: CKE < 0.2V (E4 = 0, E3 = 0)
Self refresh current: CKE < 0.2V (E4 = 0, E3 = 1)
Self refresh current: CKE < 0.2V (E4 = 1, E3 = 0)
RC =
t
RC (MIN)
I
Notes 1, 3, 6, 11, 13, 31 apply to entire table; notes appear on page 57; V
V
I
Note 4 applies to entire table; note appears on page 57; V
±0.2V or V
DD
DD
DD
7 Self Refresh Current Options (x16)
Q = 2.5V ±0.2V or V
Specifications and Conditions (x16)
t
RCD met; No accesses in progress
DD
= +2.5V ±0.2V, V
DD
= +2.5V ±0.2V, V
t
t
t
RFC =
RFC = 15.625µs
RFC = 3.906µs(AT)
DD
Q = +1.8V ±0.15V
t
RFC (MIN)
DD
Q = +1.8V ±0.15V
55
Symbol
I
I
I
I
I
I
I
DD1
DD2
DD3
DD4
DD5
DD6
DD6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
-75M
= V
130
450
115
225
40
3
6
128Mb: x16, x32 Mobile SDRAM
DD
Temperature
Q = +3.3V ±0.3V or V
Max
85ºC
70ºC
45ºC
15ºC
Max
130
450
100
210
40
DD
-8
3
6
Electrical Specifications
= V
DD
©2001 Micron Technology, Inc. All rights reserved.
Q = +3.3V ±0.3V or V
-10
100
450
170
35
95
-75M/-8/-10
3
6
800
500
350
300
DD
= V
Units
mA
mA
mA
mA
mA
mA
µA
DD
Q = 2.5V
Units
Notes
12, 18,
19, 32,
18, 19
12, 33
18, 19
µA
µA
µA
µA
DD
19
33
=

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