MD8331-D2G-V3-X-P SanDisk, MD8331-D2G-V3-X-P Datasheet - Page 3

• Manufacturer Part Number: MD8331-D2G-V3-X-P
• Description: IC MDOC G4 2GB 69-FBGA
• Manufacturer: SanDisk

Specifications of MD8331-D2G-V3-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 2G (256M x 8)
• Speed: 33ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 69-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1149-2; MD8831-D2G-V3-X-P; MD8832-D2G-V3-X-P

TrueFFS
Operating Environment
3
Full hard-disk read/write emulation for
transparent file system management
Patented TrueFFS
Dynamic and static wear-leveling
Programming, duplicating, testing and
debugging tools available in source code
Wide OS support, including:
TrueFFS Software Development Kit (SDK)
for quick and easy support for proprietary
OSs, or OS-less environment
TrueFFS Boot Software Development Kit
(BDK)
®
Software
Flash file system management
Automatic block management
Data management to maximize the
limit of typical flash life expectancy
Dynamic virtual mapping
Symbian OS
Microsoft Windows Mobile
Palm OS
Nucleus
Windows CE
Linux
OSE
VxWorks
Data Sheet (Preliminary) Rev. 0.3
Power Requirements
Capacity and Packaging
Operating voltage
Core, I/O: 1.65 to 1.95V
Current Consumption
128MB (1Gb) capacity (single die):
256MB (2Gb) capacity (dual die):
Active mode:
Read 4.2mA
Program 7.4mA
Erase 7.4mA
Deep Power-Down mode:
10 µA (1Gb/128MB)
20 µA (2Gb/256MB)
Device cascading option for up to
four devices (4Gb)
69-ball FBGA package:
9x12x1.2 mm (width x length x
height)
Ballout compatible with
DiskOnChip G3/P3, G3/P3 LP and
H1 FBGA products
Device cascading option for up to
two devices (4Gb)
69-ball FBGA package:
9x12x1.4 mm (width x length x
height)
Ballout compatible with
DiskOnChip G3/P3, G3/P3 LP, H1
and, H3 FBGA products
DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V
92-DS-1105-00