MD8331-D2G-V3-X-P SanDisk, MD8331-D2G-V3-X-P Datasheet - Page 56

• Manufacturer Part Number: MD8331-D2G-V3-X-P
• Description: IC MDOC G4 2GB 69-FBGA
• Manufacturer: SanDisk

Specifications of MD8331-D2G-V3-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 2G (256M x 8)
• Speed: 33ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 69-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1149-2; MD8831-D2G-V3-X-P; MD8832-D2G-V3-X-P

9.3
With a multiplexed interface, DiskOnChip G4 requires the signals shown in Figure 14 below.
Notes: 1. The 0.1 µF and the 10 nF low-inductance, high-frequency capacitors must be attached to
9.4
9.4.1
When using a standard NOR-like interface, connect the control signals as follows:
56
• A[12:0] – Connect these signals to the host’s address signals (see Section 9.8 for
• D[15:0] – Connect these signals to the host’s data signals (see Section 9.8 for
• Output Enable (OE#) and Write Enable (WE#) – Connect these signals to the host RD# and
• Chip Enable (CE#) – Connect this signal to the memory address decoder. Most RISC
Address / Data
Output Enable
Write Enable
Chip Enable
Multiplexed Interface
Connecting Control Signals
Standard Interface
platform-related considerations). Address signal A[0] is multiplexed with the DPD signal.
platform-related considerations).
WR# signals, respectively.
processors include a programmable decoder to generate various Chip Select (CS) outputs for
each of the device’s VCC and VSS balls. These capacitors must be placed as close as
possible to the package leads.
Chip ID
AVD #
Reset
0 . 1 uF
ID 0
OE #
CE #
Figure 14: Multiplexed System Interface
AD ] 15 :0 [
RSTIN #
WE #
AVD #
Data Sheet (Preliminary) Rev. 0.3
10 nF
1.8V
VCC
DiskOnChip G4
0 . 1 uF
VSS
BUSY #
LOCK #
10 nF
BHE #
VCCQ
AVD #
IRQ #
DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V
1.8V
92-DS-1105-00
1 - 20 KOhm