MD8331-D2G-V3-X-P SanDisk, MD8331-D2G-V3-X-P Datasheet - Page 7

• Manufacturer Part Number: MD8331-D2G-V3-X-P
• Description: IC MDOC G4 2GB 69-FBGA
• Manufacturer: SanDisk

Specifications of MD8331-D2G-V3-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 2G (256M x 8)
• Speed: 33ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 69-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1149-2; MD8831-D2G-V3-X-P; MD8832-D2G-V3-X-P

8. Booting from DiskOnChip G4................................................................................................. 51
9. Design Considerations ........................................................................................................... 53
10. Product Specifications ........................................................................................................... 64
7
7.18 DPD Control Register ....................................................................................................... 46
7.19 DMA Control Register [1:0]............................................................................................... 47
7.20 MultiBurst Mode Control Register..................................................................................... 48
7.21 Virtual/Paged RAM Status Register ................................................................................. 49
8.1
8.2
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
10.1 Environmental Specifications ........................................................................................... 64
10.2 Electrical Specifications.................................................................................................... 64
Introduction....................................................................................................................... 51
Boot Replacement ............................................................................................................ 51
8.2.1
8.2.2
8.2.3
General Guidelines........................................................................................................... 53
Standard NOR-Like Interface ........................................................................................... 54
Multiplexed Interface ........................................................................................................ 56
Connecting Control Signals .............................................................................................. 56
9.4.1
9.4.2
Implementing the Interrupt Mechanism ............................................................................ 58
9.5.1
9.5.2
Device Cascading............................................................................................................. 59
Boot Replacement ............................................................................................................ 60
Platform-Specific Issues ................................................................................................... 61
9.8.1
9.8.2
9.8.3
9.8.4
Design Environment ......................................................................................................... 63
10.1.1 Operating Temperature ...................................................................................................... 64
10.1.2 Thermal Characteristics ..................................................................................................... 64
10.1.3 Humidity.............................................................................................................................. 64
10.1.4 Endurance ................................................................................ Error! Bookmark not defined.
10.2.1 Absolute Maximum Ratings................................................................................................ 64
Asynchronous Boot Mode .................................................................................................. 51
Virtual RAM Boot ................................................................................................................ 51
Paged RAM Boot................................................................................................................ 52
Standard Interface.............................................................................................................. 56
Multiplexed Interface .......................................................................................................... 57
Hardware Configuration ..................................................................................................... 58
Software Configuration....................................................................................................... 58
Wait State ........................................................................................................................... 61
Big and Little Endian Systems............................................................................................ 61
Busy Signal......................................................................................................................... 61
Working with 8/16/32-Bit Systems...................................................................................... 61
Data Sheet (Preliminary) Rev. 0.3
DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V
92-DS-1105-00