MD5811-D256-V3Q18-P SanDisk, MD5811-D256-V3Q18-P Datasheet - Page 5

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MD5811-D256-V3Q18-P

Manufacturer Part Number
MD5811-D256-V3Q18-P
Description
IC MDOC P3 256MB 48-TSOP
Manufacturer
SanDisk
Datasheet

Specifications of MD5811-D256-V3Q18-P

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
256M (32M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Quantity
Price
Part Number:
MD5811-D256-V3Q18-P
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M-SYSTEMS
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Part Number:
MD5811-D256-V3Q18-P/Y
Manufacturer:
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Quantity:
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Part Number:
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M-SYSTEMS
Quantity:
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5. Hardware Protection ............................................................................................................... 32
6. Modes of Operation................................................................................................................. 35
7. TrueFFS Technology............................................................................................................... 38
8. Register Descriptions ............................................................................................................. 42
2
4.4
5.1
5.2
6.1
6.2
6.3
7.1
7.2
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10 Configuration Register...................................................................................................... 47
8.11 Interrupt Control Register ................................................................................................. 48
8.12 Interrupt Status Register................................................................................................... 49
8.13 Output Control Register.................................................................................................... 50
8.14 DPD Control Register ....................................................................................................... 51
Turbo Operation ............................................................................................................... 31
Method of Operation......................................................................................................... 32
Low-Level Structure of the Protected Area....................................................................... 33
Normal Mode .................................................................................................................... 36
Reset Mode ...................................................................................................................... 36
Deep Power-Down Mode ................................................................................................. 36
General Description.......................................................................................................... 38
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
8KB Memory Window ....................................................................................................... 41
Definition of Terms ........................................................................................................... 42
Reset Values .................................................................................................................... 42
No Operation (NOP) Register........................................................................................... 43
Chip Identification (ID) Register [0:1]................................................................................ 43
Test Register .................................................................................................................... 43
Bus Lock Register ............................................................................................................ 44
Endian Control Register ................................................................................................... 45
DiskOnChip Control Register/Control Confirmation Register ........................................... 46
Device ID Select Register................................................................................................. 47
Built-In Operating System Support..................................................................................... 39
TrueFFS Software Development Kit (SDK)........................................................................ 39
File Management................................................................................................................ 39
Bad Block Management ..................................................................................................... 39
Wear-Leveling .................................................................................................................... 39
Power Failure Management ............................................................................................... 40
Error Detection/Correction.................................................................................................. 40
Special Features Through I/O Control (IOCTL) Mechanism.............................................. 41
Compatibility ....................................................................................................................... 41
Data Sheet, Rev. 0.3
Mobile DiskOnChip P3
93-SR-009-8L

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