HYI25D256160CE-5 Qimonda, HYI25D256160CE-5 Datasheet - Page 31
![IC DDR SDRAM 256MBIT 66TSOP](/photos/7/31/73138/hyi25d256160ce-5_sml.jpg)
HYI25D256160CE-5
Manufacturer Part Number
HYI25D256160CE-5
Description
IC DDR SDRAM 256MBIT 66TSOP
Manufacturer
Qimonda
Datasheet
1.HYB25D256160CE-5.pdf
(37 pages)
Specifications of HYI25D256160CE-5
Format - Memory
RAM
Memory Type
DDR SDRAM
Memory Size
256M (16Mx16)
Speed
200MHz
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
-40°C ~ 85°C
Package / Case
66-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
675-1021-2
5
There are two package types used for this product family each in lead-free and lead-containing assembly:
• P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
Rev. 2.4, 2007-07
03062006-8CCM-VPUW
Description
Ball Size
Recommended Landing Pad
Recommended Solder Mask
Package Outlines
TFBGA Common Package Properties (non-green/green)
31
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Size
0.450
0.500
0.400
Internet Data Sheet
Units
mm
mm
mm
TABLE 24