MAX5956BEEE+ Maxim Integrated Products, MAX5956BEEE+ Datasheet - Page 13

• Manufacturer Part Number: MAX5956BEEE+
• Description: IC DUAL HOT-SWAP CTRLR 16-QSOP
• Manufacturer: Maxim Integrated Products
• Type: Hot-Swap Controllerr

Specifications of MAX5956BEEE+

• Applications: General Purpose
• Internal Switch(s): No
• Voltage - Supply: 1 V ~ 13.2 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.150", 3.90mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

To take full advantage of the switch response time to an
output fault condition, it is important to keep all traces as
short as possible and to maximize the high-current trace
dimensions to reduce the effect of undesirable parasitic
resistance and inductance. Place the MAX5955/
MAX5956 close to the card’s connector, and a 0.01µF
capacitor to GND should be placed as close as possible
to each V
ance and inductance. Minimize the current-sense resis-
tor trace length (< 10mm), and ensure accurate current
sensing with Kelvin connections (Figure 6).
Figure 5. Using the MAX5955/MAX5956 on a Backplane
MAX5955AEEE
MAX5955AUEE
MAX5955BEEE
MAX5955BUEE
MAX5956AEEE
MAX5956AUEE
MAX5956BEEE
MAX5956BUEE
V
IN
Low-Voltage, Dual Hot-Swap Controllers with
* REQUIRED COMPONENTS. SEE THE ON_ COMPARATORS SECTION.
IN_
IN
pin. Use a ground plane to minimize imped-
*
PART
MAX5955
MAX5956
0.1µF
SENSE_
*
______________________________________________________________________________________
GATE_
ON_
*
Layout Considerations
BACKPLANE
OUTPUT UNDERVOLTAGE/OVERVOLTAGE
REMOVABLE CARD
WITH NO HOT-INSERTION
PROTECTION
PROTECTION/MONITOR
C
BOARD
V
Independent On/Off Control
OUT
Protection
Protection
Protection
Protection
Monitor
Monitor
Monitor
Monitor
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence,
the power dissipation across the switch increases, as
does the die temperature. An efficient way to achieve
good power dissipation on a surface-mount package is
to lay out two copper pads directly under the MOSFET
package on both sides of the board. Connect the two
pads to the ground plane through vias, and use
enlarged copper mounting pads on the top side of the
board (refer to the MAX5956 EV Kit data sheet).
Figure 6. Kelvin Connection for the Current-Sense Resistors
MAX5955
MAX5956
HIGH-CURRENT PATH
FAULT MANAGEMENT
Selector Guide
Autoretry
Autoretry
Autoretry
Autoretry
Latched
Latched
Latched
Latched
SENSE RESISTOR
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