UBA2021T/N2,512 NXP Semiconductors, UBA2021T/N2,512 Datasheet
UBA2021T/N2,512
Specifications of UBA2021T/N2,512
935211250512
UBA2021T/N2
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UBA2021T/N2,512 Summary of contents
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UBA2021 630 V driver IC for CFL and TL lamps Rev. 04 — 25 July 2008 1. General description The UBA2021 is a high voltage IC intended to drive and control Compact Fluorescent Lamps (CFL) or fluorescent TL lamps. It ...
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... NXP Semiconductors Table 1. Symbol I tot R , G1(on) R G2(on G1(off) R G2(off) Feed-forward i(RHV) 4. Ordering information Table 2. Ordering information Type number Package Name UBA2021T SO14 UBA2021P DIP14 5. Block diagram n. Fig 1. UBA2021_4 Product data sheet Quick reference data Parameter Conditions total supply current f B high and low side on ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning UBA2021T 4 n. PGND 001aai566 Fig 2. Pin configuration (SO14) 6.2 Pin description Table 3. Symbol n. PGND CP RS RREF SGND CF RHV CI 7. Functional description 7.1 Introduction The UBA2021 is an integrated circuit for electronically ballasted compact fluorescent lamps and their derivatives operating with mains voltages up to 240 V (RMS). It provides all the necessary functions for preheat, ignition and on-state operation of the lamp ...
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... NXP Semiconductors 7.2 Initial start-up Initial start-up is achieved by charging capacitor CS9 with the current applied to the RHV-pin. At start-up, MOSFET T2 conducts and T1 does not conduct. This ensures C becomes charged. This start-up state is reached for a supply voltage of V the voltage level on the VS-pin at which the circuit will be reset to its initial state and maintained until the low voltage supply (V reset to the start-up state ...
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... NXP Semiconductors Fig 5. 7.5 Ignition state The RS monitoring function changes from V protection at the end of the preheat time. Normally this results in a further frequency decrease down to the bottom frequency f frequency in the ignition state is less than that in the preheat mode. During the downward frequency sweep the circuit sweeps through the resonant frequency of the load ...
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... NXP Semiconductors V , the ripple is filtered out. The capacitor connected to the CP-pin is used for this in purpose. This pin is also used in the preheat state and the ignition state for timing ( ign Fig 6. 7.9 Capacitive mode protection When the preheat mode is completed, the IC will protect the power circuit against losing the zero voltage switching condition and getting too close to the capacitive mode of operation ...
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... NXP Semiconductors 7.12 Frequency and change in frequency At any point in time during oscillation, the circuit will operate between f change in frequency will be gradual, no steps in frequency will occur. Changes in frequency caused by a change in voltage at the CI-pin show a rather constant f/ t over the entire frequency range. The following rates are realized (at a frequency of 85 kHz and with a 100 nF capacitor connected to the PCI-pin): • ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground. Symbol T stg Q couple V es [1] HBM: 2000 V, except pins FS, G1, S1 and VS which are 1000 V maximum and G2 which is 800 V maximum. [2] MM: 250 V except for the G1-pin which is 100 V. ...
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... NXP Semiconductors Table 7. Characteristics …continued amb Symbol Parameter I clamp current VS(clamp) Preheat mode f starting frequency start t conducting time T1 and charge current at pin CI CI(charge) I discharge current at pin CI CI(discharge) t preheat time ph I charge current at pin CP CP(charge) I discharge current at pin CP CP(discharge) V peak voltage difference at ...
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... NXP Semiconductors Table 7. Characteristics …continued amb Symbol Parameter f feed-forward frequency ff SYM symmetry ff RR ripple rejection R CP switch series resistance CP(sw) R averaging resistor AV [1] The start-up supply current is specifi temperature (T current is < 350 A. [2] The clamp margin is defined as the voltage difference between turn-on of the clamp and start of oscillation. The clamp is in the off-state at start of oscillation ...
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... NXP Semiconductors • Where: • bottom frequency. B • feed-forward frequency. ff • frequency due to capacitive mode detection. cm • Preheat time: • Ignition time: • Non-overlap time: 12. Application information DS1 DS2 R1 mains C2 supply DS3 DS4 Fig 7. Application diagram UBA2021_4 Product data sheet RREF ...
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... NXP Semiconductors 13. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... Document ID Release date UBA2021_4 20080725 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. UBA2021_3 20080802 UBA2021_2 20010130 UBA2021_1 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Initial start- 7.3 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.4 Operation in the preheat mode . . . . . . . . . . . . . 4 7.5 Ignition state ...