VND7NV04-1-E STMicroelectronics, VND7NV04-1-E Datasheet
VND7NV04-1-E
Specifications of VND7NV04-1-E
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VND7NV04-1-E Summary of contents
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... Built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. Fault feedback can be detected by monitoring the voltage at the input pin. Order codes Tube (lead-free) - VNN7NV0413TR - VNS7NV0413TR VND7NV04-E VND7NV0413TR VND7NV04-1-E Doc ID 7383 Rev 3 OMNIFET SO-8 SOT-223 3 1 TO252 (DPAK) TO251 (IPAK) ...
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... TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.2 TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.3 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.4 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.5 SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 5.6 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.7 DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 5.8 IPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 2/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Doc ID 7383 Rev 3 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 3. Thermal data Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 5. SO-8 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 6. SOT-223 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 7. DPAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 8. TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 9. TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 10 ...
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... DPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 45. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 46. DPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 47. Thermal fitting model of an OMNIFET II in DPAK Figure 48. TO-251 (IPAK) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Doc ID 7383 Rev 3 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 49. TO-252 (DPAK) package dimensions Figure 50. SOT-223 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 51. SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 52. SOT-223 tape and reel shipment (suffix “TR” Figure 53. SO-8 tube shipment (no suffix Figure 54. SO-8 tape and reel shipment (suffix “TR” Figure 55. ...
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... Block diagram and pin description 1 Block diagram and pin description Figure 1. Block diagram INPUT 1 Figure 2. Configuration diagram (top view) 1. For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1. 6/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Overvoltage Clamp Gate Control Linear Current Over Limiter Temperature (1) ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 2 Electrical specifications Figure 3. Current and voltage conventions 2.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol V Drain-source voltage ( Input voltage IN I Input current IN R Minimum input series impedance IN MIN I Drain current D I Reverse DC output current R Electrostatic discharge (R=1.5 KΩ, ...
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... Input-source clamp V INCL voltage Zero input voltage drain I DSS current ( Static drain-source on R DS(on) resistance Dynamic (T =25 °C, unless otherwise specified) j Forward ( transconductance C Output capacitance OSS 8/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 SOT-223 18 ( (at least 35 µm thick) connected to all DRAIN Test conditions =3 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Table 4. Electrical characteristics (continued) Symbol Parameter Switching (T =25 °C, unless otherwise specified Turn-on delay time d(on) t Rise time r t Turn-off delay time d(off) t Fall time f t Turn-on delay time d(on) t Rise time r t Turn-off delay time d(off) ...
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... I . ISS Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL logic circuit. 10/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04 jsh through the input pin in order to indicate fault gf ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 4. Switching time test circuit for resistive load Figure 5. Test circuit for diode recovery times 10% t d(on) V gen FAST OMNIFET DIODE S B 150Ω R gen I V gen Doc ID 7383 Rev 3 Protection features d(off L=100uH OMNIFET S 8.5 Ω ...
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... Protection features Figure 6. Unclamped inductive load test circuits R GEN Figure 8. Unclamped inductive waveforms 12/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 7. Input charge test circuit V IN Doc ID 7383 Rev 3 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 3.1 Electrical characteristics curves Figure 9. Derating curve Figure 11. Static drain-source on resistance vs input voltage (part 1/2) Rds(on) (mOhm) 120 110 100 3.5 4 4.5 5 Vin(V) Figure 13. Source-drain diode forward characteristics Vsd (mV) 1000 950 Vin=0V 900 850 800 750 700 ...
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... Vin(V) Figure 19. Input voltage vs input charge Vin( Vds=12V Id=3. Qg(nC) 14/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 16. Turn-on current slope (part 2/2) di/dt(A/us Vin=3.5V Vdd=15V 6 Id=3. 800 900 1000 1100 100 Figure 18. Static drain-source on resistance Rds(on) (mOhm) 140 Tj=25ºC Tj=-40ºC 120 Tj=150º ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 21. Turn-off drain source voltage slope (part 2/2) dv/dt(v/us) 300 250 200 150 100 50 0 200 400 600 100 300 500 Rg(ohm) Figure 23. Output characteristics ID( VDS(V) Figure 25. Switching time resistive load (part 1/2) t(us) 5.5 5 Vdd=15V 4.5 Id=3 ...
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... T(ºC) Figure 29. Step response current limit Tdlim(us) 7 6.5 Rg=150ohm 6 5.5 5 4 Vdd(V) 16/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 28. Normalized current limit vs junction Ilim ( Vds=Vin 13 Id=1mA 100 125 150 175 -50 Vin= Doc ID 7383 Rev 3 temperature Vds=13V ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 3.2 SO-8 maximum demagnetization energy Figure 30. SO-8 maximum turn-off current versus load inductance I LMAX (A) 100 10 1 0.1 Legend A = Single Pulse Repetitive pulse Repetitive Pulse at T Conditions: V =13 Values are generated with R demagnetization) of every pulse must not exceed the temperature specified above for curves B and C ...
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... V =13 Values are generated with R demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. Figure 33. DPAK demagnetization 18/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 0 =150 °C Jstart =100 °C Jstart =125 °C Jstart =0 Ω. In case of repetitive pulses Demagnetization Doc ID 7383 Rev 3 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 3.4 SOT-223 maximum demagnetization energy Figure 34. SOT-223 maximum turn-off current versus load inductance I LMAX (A) 100 10 1 0.01 Legend A = Single Pulse Repetitive pulse Repetitive Pulse at T Conditions: V =13 Values are generated with R demagnetization) of every pulse must not exceed the temperature specified above for curves B and C ...
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... Figure 36. SO-8 PC board Note: Layout condition of R thickness=2 mm, Cu thickness=35 µm, Copper areas: 0.14 cm Figure 37. R thj-amb RTHj_amb (ºC/W) 20/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 and Z measurements (PCB FR4 area= mm, PCB PCB copper area in open box free air condition SO pins connected to TAB 110 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 38. SO-8 thermal impedance junction ambient single pulse ZT H (°C /W) 1000 100 10 1 0.1 0.0001 0.001 Figure 39. Thermal fitting model of an OMNIFET II in SO-8 Equation 1 Pulse calculation formula ⋅ δ THδ TH δ T ⁄ where Table 5. SO-8 thermal parameter Area/island (cm 0 ...
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... Cu thickness=35 µm, Copper areas: 0.11 cm Figure 41. R thj-amb RTH j-amb (°C/W) 140 130 120 110 100 22/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) and Z measurements (PCB FR4 area= mm, PCB PCB copper area in open box free air condition 0 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 42. SOT-223 thermal impedance junction ambient single pulse ZT H (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Figure 43. Thermal fitting model of an OMNIFET II in SOT-223 Tj Equation 2 Pulse calculation formula ⋅ δ THδ TH δ T ⁄ where = t p Table 6. SOT-223 thermal parameter Area/island (cm 0 ...
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... Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8 cm2). Figure 45. R thj-amb RTH j_amb (ºC/ 24/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) and Z measurements (PCB FR4 area= mm, PCB PCB copper area in open box free air condition ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 46. DPAK thermal impedance junction ambient single pulse ZT H (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Figure 47. Thermal fitting model of an OMNIFET II in DPAK Tj Pd Equation 3 Pulse calculation formula ⋅ δ THδ TH δ T ⁄ where = t p Table 7. ...
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... Package and PCB thermal data Table 7. DPAK thermal parameter (continued) Area/island (cm 26/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 7383 Rev 3 Footprint 6 0.0006 0.0021 0.05 0.3 0.45 0.8 5 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 5 Package and packing information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® trademark. 5.1 TO-251 (IPAK) mechanical data Table 8 ...
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... Figure 48. TO-251 (IPAK) package dimensions 5.2 TO-252 (DPAK) mechanical data Table 9. TO-252 (DPAK) mechanical data Symbol 28/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 millimeters Min. Typ. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 5.1 6.40 4.7 2.28 4.40 9.35 Doc ID 7383 Rev 3 Max. 2.40 1 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Table 9. TO-252 (DPAK) mechanical data (continued) Symbol Package Weight Figure 49. TO-252 (DPAK) package dimensions 5.3 SOT-223 mechanical data Table 10. SOT-223 mechanical data Symbol Package and packing information millimeters Min. Typ. 0.8 0.60 0.2 0° 8° Gr. 0.29 millimeters Min ...
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... SOT-223 mechanical data (continued) Symbol Figure 50. SOT-223 package dimensions 5.4 SO-8 mechanical data Table 11. SO-8 mechanical data Symbol 30/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 millimeters Min. Typ. 4.6 3.3 3.5 6 (max) 0.02 millimeters Min Typ 0.1 0.65 0.35 0.10 Doc ID 7383 Rev 3 Max. 3.7 7 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Table 11. SO-8 mechanical data (continued) Symbol ( ( ccc 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0. total (both side). 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0 ...
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... According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing All dimensions are in mm. 32/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04 (± 0. (± 0.1/-0) 1.5 D1 (min) 1.5 F (± 0.05) 5 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 5.6 SO-8 packing information Figure 53. SO-8 tube shipment (no suffix) Figure 54. SO-8 tape and reel shipment (suffix “TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing ...
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... TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing All dimensions are in mm. 34/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04 (± 0. (± 0.1/-0) 1 ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 5.8 IPAK packing information Figure 57. IPAK tube shipment (no suffix Base Q.ty Bulk Q.ty Tube length (± 0. (± 0.1) All dimensions are in mm. Doc ID 7383 Rev 3 Package and packing information 75 3000 532 6 21.3 0.6 35/37 ...
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... Revision history 6 Revision history Table 12. Document revision history Date 01-Feb-2003 28-Apr-2009 10-Sep-2010 36/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Revision 1 Initial Release Added Table 1: Device summary on page 1 Package and PCB thermal data on page 2 Updated Section 5: Package and packing information on page 27. 3 Updated Table 4: Electrical characteristics ...
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... VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...