IR3507MTRPBF International Rectifier, IR3507MTRPBF Datasheet - Page 17

IC XPHASE3 CONTROL 20-MLPQ

IR3507MTRPBF

Manufacturer Part Number
IR3507MTRPBF
Description
IC XPHASE3 CONTROL 20-MLPQ
Manufacturer
International Rectifier
Series
XPhase3™r
Datasheet

Specifications of IR3507MTRPBF

Applications
Processor
Current - Supply
4mA
Voltage - Supply
8 V ~ 28 V
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-MLPQ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3507MTRPBFTR
Solder Resist
• The solder resist should be pulled away from the metal lead lands and center pad by a minimum of 0.06mm.
• The minimum solder resist width is 0.13mm. At the inside corner of the solder resist where the lead land
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect
• The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore, pulling the S/R 0.06mm will always ensure NSMD pads.
groups meet, it is recommended to provide a fillet so a solder resist width of ≥ 0.17mm remains.
ratio of the solder resist strip separating the lead lands from the pad land.
diameter of the via.
Page 17 of 19
NOT RECOMMENDED FOR NEW DESIGNS
REPLACEMENT PRODUCT – IR3507ZPBF
IR Confidential
IR3507PbF
April 2, 2009

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