MAX15048ETJ+ Maxim Integrated Products, MAX15048ETJ+ Datasheet - Page 31

IC CTRLR PWM STP-DN TRIPL 32WQFN

MAX15048ETJ+

Manufacturer Part Number
MAX15048ETJ+
Description
IC CTRLR PWM STP-DN TRIPL 32WQFN
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX15048ETJ+

Applications
Power Supply Controller, Sequencer
Voltage - Supply
4.7 V ~ 23 V
Current - Supply
6mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-WQFN Exposed Pad
Number Of Outputs
3
Output Voltage
5 V
Input Voltage
4.7 V to 23 V
Supply Current
6 mA
Switching Frequency
200 KHz
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Input
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
The 32-pin TQFN thermally enhanced package can
dissipate up to 2758.6mW. Calculate power dissipation
in the MAX15048/MAX15049 as a product of the input
voltage and the total REG output current (I
includes quiescent current (I
current (I
where Q
low-side and high-side external MOSFETs, f
switching frequency of the converter, and I
escent current of the device at the switching frequency.
Use the following equation to calculate the maximum
power dissipation (P
temperature (T
Use the following guidelines to lay out the switching volt-
age regulator:
1) Place the IN, REG, and DREG_ bypass capacitors
2) Minimize the area and length of the high-current
PROCESS: BiCMOS
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
©
2010 Maxim Integrated Products
close to the MAX15048/MAX15049.
loops from the input capacitor, upper switching
MOSFET, inductor, and output capacitor back to the
input capacitor negative terminal.
G1
DREG
to Q
I
REG
P
DMAX
):
A
G6
):
Applications Information
+ Q
= I
comprise the total gate charge of the
P
DMAX
Q
= 34.5 x (150 - T
D
G3
+ [f
= V
+ Q
) in the chip at a given ambient
SW
IN
PCB Layout Guidelines
G4
Chip Information
Q
x I
x (Q
) and the total gate-drive
PWM Controller
+ Q
REG
Power Dissipation
G1
G5
+ Q
A
)mW
+ Q
G2
Triple-Output Buck Controllers
G6
Q
REG
)]
SW
is the qui-
). I
is the
REG
with Tracking/Sequencing
Maxim is a registered trademark of Maxim Integrated Products, Inc.
3) Keep the current loop formed by the lower switching
4) Keep SGND and PGND_ isolated and connect them
5) Avoid long traces between the DREG_ bypass
6) Place the bank of the output capacitors close to the
7) Distribute the power components evenly across the
8) Provide sufficient copper area at and around the
9) Connect the MAX15048/MAX15049 exposed pad to
10) Use 2oz copper to keep the trace inductance
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
MOSFET, inductor, and output capacitor short.
at one single point close to the negative terminal of
the input filter capacitor.
capacitor, low-side driver outputs of the MAX15048/
MAX15049, MOSFET gate, and PGND_. Minimize
the loop formed by the DREG_ bypass capacitor,
bootstrap capacitor, high-side driver output of the
MAX15048/MAX15049, and upper MOSFET gates.
load.
board for proper heat dissipation.
switching MOSFETs and inductor to aid in thermal
dissipation.
a large copper plane to maximize its power dissipa-
tion capability. Connect the exposed pad to SGND.
Do not connect the exposed pad to the SGND pin
directly underneath the IC.
and resistance to a minimum. Thin copper PCBs
can compromise efficiency since high currents are
involved in the application. Also, thicker copper
conducts heat more effectively, thereby reducing
thermal impedance.
32 TQFN-EP
PACKAGE CODE
Package Information
T3255+4
DOCUMENT NO.
21-0140
31

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