UC3845AD Microsemi Analog Mixed Signal Group, UC3845AD Datasheet - Page 2
UC3845AD
Manufacturer Part Number
UC3845AD
Description
IC CTRLR PWM CURRENT MODE 14SOIC
Manufacturer
Microsemi Analog Mixed Signal Group
Datasheet
1.UC3844AM.pdf
(8 pages)
Specifications of UC3845AD
Pwm Type
Current Mode
Number Of Outputs
1
Frequency - Max
500kHz
Duty Cycle
50%
Voltage - Supply
8.2 V ~ 25 V
Buck
Yes
Boost
Yes
Flyback
Yes
Inverting
No
Doubler
No
Divider
No
Cuk
No
Isolated
Yes
Operating Temperature
0°C ~ 70°C
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Frequency-max
500kHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UC3845AD1
Manufacturer:
TI
Quantity:
5 162
Part Number:
UC3845AD8TR
Manufacturer:
TI/UNITRODE
Quantity:
20 000
Company:
Part Number:
UC3845AD8TRG4
Manufacturer:
ST
Quantity:
16 109
Company:
Part Number:
UC3845ADM-TR
Manufacturer:
VIA
Quantity:
30
Company:
Part Number:
UC3845ADTR
Manufacturer:
TI
Quantity:
14 698
UC184xA/284xA/384xA
2
Peak Package Solder Reflow Temp. (40 second max. exposure)..........................................260°C (+0, -5)
Supply Voltage (Low Impedance Source) (V
Supply Voltage (I
Output Current ............................................................................................................. ±1A
Output Energy (Capacitive Load) ................................................................................. 5µJ
Analog Inputs (V
Error Amp Output Sink Current ............................................................................... 10mA
Power Dissipation at T
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
M PACKAGE:
DM PACKAGE:
D PACKAGE:
Y PACKAGE:
Junction Temperature Calculation: T
The
All of the above assume no ambient airflow
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
A B S O L U T E M A X I M U M R AT I N G S
FB
CC
& I
< 30mA) .......................................................................... Self Limiting
SENSE
A
= 25°C (M Package) .............................................................. 1W
) ........................................................................ -0.3V to +6.3V
T H ER MAL DATA
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
J
= T
C
A
U R R E N T
+ (P
P
R O D U C T I O N
D
CC
x
) ......................................................... 30V
JA
JA
JA
JA
JA
).
M
O D E
P W M C
(Note 1)
D
A T A
165°C/W
120°C/W
130°C/W
95°C/W
O N T R O L L E R
S
H E E T
RoHS / Pb-free 100% Matte Tin Lead Finish
PACKAGE PIN OUTS
COMP
R
COMP
N.C.
N.C.
I
N.C.
SENSE
T
R
/C
V
I
COMP
SENSE
T
/C
V
FB
R
T
I
M & Y PACKAGE
SENSE
T
FB
/C
T
V
DM PACKAGE
FB
D PACKAGE
T
(Top View)
(Top View)
(Top View)
1
2
3
4
5
6
7
1
2
3
4
1
2
3
4
14
13
12
11
10
8
7
6
5
9
8
8
7
6
5
V
V
OUTPUT
GND
REF
CC
V
V
OUTPUT
GND
V
N.C.
V
V
OUTPUT
GND
PWR GND
Copyright © 1995
REF
CC
REF
CC
C
Rev. 1.2a 10/25