GNM314R72A681KD01D Murata Electronics North America, GNM314R72A681KD01D Datasheet - Page 87

CAP 4-ARRAY 680PF 100V X7R 1206

GNM314R72A681KD01D

Manufacturer Part Number
GNM314R72A681KD01D
Description
CAP 4-ARRAY 680PF 100V X7R 1206
Manufacturer
Murata Electronics North America
Series
GNMr
Datasheet

Specifications of GNM314R72A681KD01D

Capacitance
680pF
Voltage - Rated
100V
Dielectric Material
Ceramic
Number Of Capacitors
4
Circuit Type
Isolated
Temperature Coefficient
X7R
Tolerance
±10%
Mounting Type
Surface Mount
Package / Case
1206 (3216 Metric)
Height
0.031" (0.80mm)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-3419-2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4. Leaded Component Insertion
5. Flow Soldering
Table 2
Recommended Conditions
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Peak Temperature
If the PCB is flexed when leaded components (such as
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. And an excessively long
soldering time or high soldering temperature results in
leaching of the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage in the
components, preheating shoud be required for the both
components and the PCB board. Preheating conditions
are shown in table 2. It is required to keep temperature
differential between the soldering and the components
surface ( T) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
Optimum Solder Amount for Flow Soldering
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Atmosphere
GRM18/21/31
LLL21/31
ERB18/21
GQM18/21
Part Number
Pb-Sn Solder
240-250 C
Air
Temperature Differential
TV150D
Lead Free Solder
250-260 C
N
2
[Standard Conditions for Flow Soldering]
[Allowable Soldering Temperature and Time]
Peak Temperature
Temperature (D)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
280
270
260
250
240
230
220











170 C
150 C
130 C
0
Adhesive






T
10
60-120 seconds
Preheating
20
Continued on the following page.
Soldering
5 seconds max.
Soldering Time (sec.)
30
Up to Chip Thickness
!Caution
Gradual
Cooling
Time
40
C02E.pdf
85
07.2.6
13

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