FAN2002MPX Fairchild Semiconductor, FAN2002MPX Datasheet - Page 3

• Manufacturer Part Number: FAN2002MPX
• Description: IC CONV DC/DC 1A ADJ STPDWN 6MLP
• Manufacturer: Fairchild Semiconductor
• Type: Step-Down (Buck)r

Specifications of FAN2002MPX

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 5.5 V
• Current - Output: 1A
• Frequency - Switching: 1.3MHz
• Voltage - Input: 2.5 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-MLP
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: FAN2002MPXTR; FAN2002MPX_NL; FAN2002MPX_NLTR; FAN2002MPX_NLTR

FAN2001/FAN2002 Rev. 1.0.2
Absolute Maximum Ratings
Recommended Operating Conditions
Notes:
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional
2. Junction to ambient thermal resistance, θ
3. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
4. Refer to the applications section for further details.
V
Voltage On Any Other Pin
Lead Soldering Temperature (10 seconds)
Junction Temperature
Storage Temperature
Thermal Resistance-Junction to Tab ( θ
Electrostatic Discharge Protection (ESD) Level (Note 3)
Supply Voltage Range
Output Voltage Range, Adjustable Version
Output Current
Inductor (Note 4)
Input Capacitor (Note 4)
Output Capacitor (Note 4)
Operating Ambient Temperature Range
Operating Junction Temperature Range
operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are referenced to AGND.
via used, diameter of via used, available copper surface, and attached heat sink characteristics.
IN
, PV
IN
Parameter
JA
JC
Parameter
, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of
)
,
3x3mm 6-lead MLP (Note 2)
(Note1)
3
HBM
CDM
Min
-40
-40
2.5
0.8
2 x 10
Typ
Min
-0.3
-0.3
3.3
-65
10
4
1
Max
Max
+125
+85
260
150
150
5.5
V
V
1
7
8
IN
IN
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Unit
Unit
°C/W
µ H
µF
µF
kV
°C
°C
°C
°C
°C
V
V
A
V
V