BD9701FP-E2 Rohm Semiconductor, BD9701FP-E2 Datasheet - Page 12

• Manufacturer Part Number: BD9701FP-E2
• Description: IC REG SW STEP DOWN 1CH TO252-5
• Manufacturer: Rohm Semiconductor
• Type: Step-Down (Buck)r

Specifications of BD9701FP-E2

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 1 ~ 32 V
• Current - Output: 1.5A
• Frequency - Switching: 100kHz
• Voltage - Input: 8 ~ 36 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: DPak, TO-252 (4 leads + tab)
• Power - Output: 800mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BD9701FP-E2TR

●I/O Equivalent Circuit
●Notes for use
VCC
GND
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BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5
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Pin 1 (VCC), Pin 3 (GND)
1. Absolute Maximum Ratings
2. GND voltage
3. Thermal design
4. Inter-pin shorts and mounting errors
5. Operation in strong electromagnetic field
6. Thermal shutdown circuit (TSD circuit)
7. Testing on application boards
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC deterioration or damage. Assumptions should not be made regarding the state of the IC (short mode or open
mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the
IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin
carry a voltage lower than or equal to the GND pin, including during actual transient phenomena.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pin caused by the
presence of a foreign object may result in damage to the IC.
Operation in a strong electromagnetic field may cause malfunction.
This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. Do not continue to use the IC after operating this circuit or use the IC in an
environment where the operation of the thermal shutdown circuit is assumed.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure,
and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process.
OUT
Pin 2 (OUT)
Fig.33Input Output Equivalent Circuit
VCC
12/16
INV
Pin 4 (INV)
VCC
300Ω
STB
Pin 5 (STBY)
Technical Note
VC
2009.04- Rev.B
140KΩ
60KΩ
70KΩ