HCNW2611-300E Avago Technologies US Inc., HCNW2611-300E Datasheet - Page 7
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HCNW2611-300E
Manufacturer Part Number
HCNW2611-300E
Description
OPTOCPLR LOG-OUT 10MBD GW 8SMD W
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0600-500E.pdf
(22 pages)
Specifications of HCNW2611-300E
Package / Case
8-SMD (400 mil) Gull Wing
Voltage - Isolation
5000Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
50ns @ 7.5mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
5000 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
0.01 us
Maximum Forward Diode Current
20 mA
Minimum Forward Diode Voltage
1.25 V
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
10 MBd(Typ)
Maximum Forward Diode Voltage
1.85 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
85 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
No. Of Channels
1
Optocoupler Output Type
Logic Gate
Input Current
15mA
Output Voltage
7V
Opto Case Style
SMD
No. Of Pins
8
Common Mode Ratio
10000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1619-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCNW2611-300E
Manufacturer:
AVAGO
Quantity:
30 000
Part Number:
HCNW2611-300E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Temperature Profile
7
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
TEMPERATURE
ROOM
(0.071 ± 0.006)
1.80 ± 0.15
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
1
8
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
3 °C + 1 °C/–0.5 °C
4
5
(0.061)
MAX.
1.55
150 °C, 90 + 30 SEC.
PREHEATING TIME
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
MAX.
(0.030 ± 0.010)
2.5 C ± 0.5 °C/SEC.
0.75 ± 0.25
100
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
245 °C
TEMP.
PEAK
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
150
11.00
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
50 SEC.
7° NOM.
SOLDERING
200 °C
TIME
200
(0.534)
13.56
(0.010
0.254
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
- 0.002)
+ 0.076
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250