HCPL-3180-300E Avago Technologies US Inc., HCPL-3180-300E Datasheet - Page 5

• Manufacturer Part Number: HCPL-3180-300E
• Description: OPTOCOUPLER 2.0A 250KHZ GW 8-SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-3180-300E

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 2.5A
• Propagation Delay High - Low @ If: 150ns @ 10mA
• Current - Dc Forward (if): 16mA
• Input Type: DC
• Output Type: Gate Driver
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Fall Time: 0.025 us
• Maximum Forward Diode Current: 25 mA
• Minimum Forward Diode Voltage: 1.2 V
• Output Device: Integrated Photo IC
• Configuration: 1 Channel
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 295 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 1
• Forward Voltage: 1.8V
• Forward Current: 25mA
• Package Type: PDIP SMD
• Operating Temp Range: -40C to 100C
• Power Dissipation: 295mW
• Propagation Delay Time: 200ns
• Pin Count: 8
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 5V
• Operating Temperature Classification: Industrial
• No. Of Channels: 1
• Optocoupler Output Type: Gate Drive
• Input Current: 16mA
• Output Voltage: 20V
• Opto Case Style: SMD
• No. Of Pins: 8
• Propagation Delay Low-high: 0.2µs
• Rohs Compliant: Yes
• Common Mode Ratio: 10 KV/uS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1675-5

Insulation and Safety Related Specifications
Parameter
Note: Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
5
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
Isolation Group
Storage Temperature
Junction Temperature
Average Input Current
Peak Transient Input Current
(<1 µs pulse width, 300 pps)
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Supply Voltage
Output Voltage
Output Power Dissipation
Total Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
(Comparative Tracking Index)
800
700
600
500
400
300
200
100
0
0
25
T
S
50
– CASE TEMPERATURE – °C
75
100
125
P
I
S
150 175
S
(mA)
(mW)
200
Symbol
L(101)
L(102)
CTI
HCPL-3180
7.1
7.4
0.08
>175
IIIa
Symbol
T
T
I
I
V
I
I
V
V
P
P
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
F(AVG)
F(TRAN)
OH(PEAK)
OL(PEAK)
J
S
O
T
R
CC
O(PEAK)
-V
EE
Units
mm
mm
mm
V
Min.
-55
-40
-0.5
0
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance conductor to
conductor, usually the straight line distance
thickness between the emitter and detector.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Max.
125
125
25
1.0
5
2.5
2.5
25
V
250
295
CC
Units
°C
°C
mA
A
V
A
A
V
V
mW
mW
Note
1
2
2
3
4