HCPL-0531-500E Avago Technologies US Inc., HCPL-0531-500E Datasheet - Page 9

• Manufacturer Part Number: HCPL-0531-500E
• Description: OPTOCOUPLER T-OUT 2CH 1MBD 8SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0531-500E

• Input Type: DC
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 8mA
• Data Rate: 1MBd
• Propagation Delay High - Low @ If: 200ns @ 16mA
• Current - Dc Forward (if): 25mA
• Output Type: Open Collector
• Mounting Type: Surface Mount, Gull Wing
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 8 mA
• Maximum Forward Diode Current: 25 mA
• Output Device: Phototransistor
• Configuration: 2 Channel
• Current Transfer Ratio: 50 %
• Maximum Baud Rate: 1 MBps
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 25 mA
• Maximum Power Dissipation: 45 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• Number Of Elements: 2
• Reverse Breakdown Voltage: 5V
• Forward Voltage: 1.7V
• Forward Current: 25mA
• Package Type: SOIC
• Collector Current (dc) (max): 8mA
• Power Dissipation: 45mW
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temp Range: -55C to 100C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1484-2

Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
(each channel)
Peak Forward Input Current (each channel)
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current (each channel)
(≤ 1 μs pulse width, 300 pps)
Reverse LED Input Voltage (each channel)
Input Power Dissipation (each channel)
Average Output Current (each channel)
Peak Output Current
Supply Voltage (Pin 8-5)
Output Voltage (Pins 7-5, 6-5)
Output Power Dissipation (each channel)
Lead Solder Temperature
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds
Reflow Temperature Profile
9
Symbol
T
T
I
I
I
V
P
I
I
V
V
P
T
T
F(AVG)
F(PEAK)
F(TRANS)
O(AVG)
O(PEAK)
A
CC
O
S
R
O
LS
RP
IN
Device
8 Pin DIP
SO-8 and
Option 300
Min.
-55
-55
-0.5
-0.5
see Package Outline Drawings
Max.
125
100
25
50
1
5
45
8
16
30
20
35
260
section
Units
°C
°C
mA
mA
A
V
mW
mA
mA
V
V
mW
°C
Note
13