HCPL-2211 Avago Technologies US Inc., HCPL-2211 Datasheet - Page 6

• Manufacturer Part Number: HCPL-2211
• Description: OPTOCOUPLER LOGIC-OUT 5MBD 8-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2211

• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 5MBd
• Propagation Delay High - Low @ If: 150ns @ 3mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• No. Of Channels: 1
• Isolation Voltage: 3.75kV
• Optocoupler Output Type: Logic Gate
• Input Current: 5mA
• Output Voltage: 20V
• Opto Case Style: DIP
• No. Of Pins: 8
• Propagation Delay Low-high: 0.3µs
• Forward Voltage: 1.5V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 516-1059-5

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)
Solder Reflow Temperature Profile
6
TEMPERATURE
(0.071 ± 0.006)
1.80 ± 0.15
ROOM
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
1
8
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
6
3
BSC
2.54
4
5
50
(0.061)
MAX.
1.55
3 °C + 1 °C/–0.5 °C
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
150 °C, 90 + 30 SEC.
PREHEATING TIME
MAX.
(0.030 ± 0.010)
0.75 ± 0.25
2.5 C ± 0.5 °C/SEC.
100
LAND PATTERN RECOMMENDATION
TIME (SECONDS)
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
245 °C
TEMP.
PEAK
1.00 ± 0.15
12.30 ± 0.30
(0.433)
11.00
150
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
7
o
NOM.
50 SEC.
(0.534)
SOLDERING
13.56
(0.010
0.254
200 °C
TIME
200
- 0.0051
+ 0.003)
+ 0.076
- 0.002)
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250