PC725V0YSZXF Sharp Microelectronics, PC725V0YSZXF Datasheet
PC725V0YSZXF
Specifications of PC725V0YSZXF
Related parts for PC725V0YSZXF
PC725V0YSZXF Summary of contents
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PC725V0NSZXF Series ■ Description PC725V0NSZXF Series contains an IRED optically coupled to a phototransistor packaged pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 300V, CTR is MIN. ...
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... Product mass : approx. 0.35g Anode 1 6 Cathode Emitter 4 Collector 5 4 Base 6 2. Through-Hole (VDE option) [ex. PC725V0YSZXF] ±0.2 0.6 SHARP 6 mark "S" Anode mark 1 7.12 ±0.3 7.62 Epoxy resin ±0.25 2.54 θ θ 13˚ Product mass : approx. 0.36g 4. SMT Gullwing Lead-Form (VDE option) [ex. PC725V0YIPXF] ± ...
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Wide SMT Gullwing Lead-Form [ex. PC725V0NUZXF] ±0.2 0.6 ±0.3 1.2 Factory identification mark SHARP mark "S" Date code Anode mark ±0.5 7.62 7.12 Epoxy resin ±0.25 2.54 ±0.25 0.75 10.16 12.0 Product mass ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Collector-base voltage V CBO Emitter-base voltage V EBO Collector current I C Collector ...
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... DIN −−−−−− Approved EN60747-5-2 Model No. PC725V0NSZXF PC725V0YSZXF Please contact a local SHARP sales representative to inquire about production status. SMT Gullwing −−−−−− Approved −−−−−− PC725V0NIZXF PC725V0YIZXF PC725V0NIPXF PC725V0YIPXF PC725V0NUZXF PC725V0YUZXF ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 350 300 250 200 150 100 50 0 − ...
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Fig.7 Current Transfer Ratio vs. Forward Current 8 000 V = =25˚ 000 6 000 R =∞ 000 R =1MΩ 000 R =500kΩ 000 2 000 1 000 0 0.1 ...
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Fig.13 Test Circuit for Response Time V CC Input R D Output R L Output Input V CE Please refer to the conditions in Fig.12 Fig.15 Test Circuit for Frequency Response R D Please refer to the conditions in Fig.14 ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. ...
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Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ...
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Wide SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.2 0.4 Reel structure ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...