TLP550 Toshiba, TLP550 Datasheet

PHOTOCOUPLER HS TRANS-OUT 8DIP

TLP550

Manufacturer Part Number
TLP550
Description
PHOTOCOUPLER HS TRANS-OUT 8DIP
Manufacturer
Toshiba
Datasheets

Specifications of TLP550

Number Of Channels
1
Input Type
DC
Voltage - Isolation
2500Vrms
Current Transfer Ratio (min)
10% @ 16mA
Voltage - Output
15V
Current - Output / Channel
8mA
Current - Dc Forward (if)
25mA
Output Type
Transistor with Base
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Other names
TLP550(Y)
TLP5500

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLP550
Manufacturer:
TOS
Quantity:
16 920
Part Number:
TLP550
Manufacturer:
TOSHIBA
Quantity:
1 000
Part Number:
TLP550
Manufacturer:
TOSHIBA
Quantity:
1 000
Part Number:
TLP550
Manufacturer:
ST
0
Part Number:
TLP550
Quantity:
1 650
Part Number:
TLP550
Manufacturer:
TOSHIBA
Quantity:
709
Part Number:
TLP550(F)
Manufacturer:
TOSHIBA
Quantity:
49 445
Part Number:
TLP550G
Manufacturer:
MCL
Quantity:
2
Part Number:
TLP550GP
Manufacturer:
XILINX
Quantity:
120
2011-3
PRODUCT GUIDE
Photocouplers and Photorelays
S E M I C O N D U C T O R
h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / e n g

TLP550 Summary of contents

Page 1

PRODUCT GUIDE Photocouplers and Photorelays ...

Page 2

... IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065. Small-Package Products Toshiba offers a wide variety of photocouplers in a small package to meet the space-saving requirement of increasingly smaller and thinner end products. Packaging options include mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat SOP packages ...

Page 3

Product Index Part Number Package TLP104 SO6 IC MFSOP6 TLP105 IC TLP108 MFSOP6 IC TLP109 SO6 IC TLP109 ( IGM ) SO6 IC TLP116A SO6 IC TLP117 MFSOP6 IC TLP118 SO6 IC TLP124 MFSOP6 Transistor TLP126 MFSOP6 Transistor TLP127 ...

Page 4

... DIP16 Darlington transistor DIP4 TLP525G Triac TLP525G-2 DIP8 Triac TLP525G-4 DIP16 Triac TLP531 DIP6 Transistor TLP532 DIP6 Transistor TLP548J DIP6 Thyristor TLP549J DIP8 Thyristor DIP8 TLP550 IC TLP551 DIP8 IC TLP552 DIP8 IC TLP553 DIP8 IC TLP554 DIP8 IC Output Page Part Number 27 TLP555 27 TLP557 27 TLP558 27 ...

Page 5

... New Products Small Surface-Mount IC-Output Photocouplers in the SO8 Package Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package. To meet customer needs, Toshiba has released photocouplers featuring various data rates, dual-channel configurations and power device drivers. Data rate Part Number (typ ...

Page 6

... TLP2108 2-ch IC-Output Photocouplers for IPM Drive Applications Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay times, a wider operating temperature range and digital output. Thus, they help to simplify system design and improve system performance ...

Page 7

... High-ION Photorelays: TLP354x Series (Under Development) Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current. Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc current respectively ...

Page 8

... General-Purpose Photorelays Certified for Reinforced Insulation: TLP220 Series and TLP221A (Under Development) Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage between input and output, as well as for international safety standards certification ...

Page 9

Photocoupler Product Tree Photocoupler Product Tree Package DIP4 DIP6 DIP8 DIP16 SO8 SOP4 2.54SOP4 2.54SOP6 Transistor-Output Photorelays Photorelays Thyristor- and Triac-Output Triac Output Thyristor Output ZC DIP4 DIP6 DIP8 DIP16 ● ≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness SDIP6 ...

Page 10

... Vrms High I 5000 Vrms F Darlington 2500 Vrms 2500 Vrms High V CEO 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. SOP16 SOP16 SO6 SO16 MFSOP6 Quad Single Quad Single ...

Page 11

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 12

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

Page 13

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

Page 14

... Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative. ...

Page 15

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 16

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 17

... Mbit/s (max) 125˚C (Inverter logic) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 17 DIP8 DIP6 JEDEC 1ch 2ch TLP553 6N138 6N139 TLP512 TLP550 TLP2530 6N135 TLP551 TLP2531 6N136 TLP559 TLP651 TLP750 TLP751 TLP759 1 TLP559(IGM) TLP759(IGM) TLP754* ...

Page 18

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 19

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 20

... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 21

... Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.) Part Number Pin Configuration TLP109 SO6 (reinforced insulation SO8 TLP2409 Topr = 125˚C(max) SO8 version of the TLP109 DIP6 6-pin package version TLP512 of the TLP550 DIP8 TLP550 High CMR DIP8 TLP551 Internal base connection ...

Page 22

... TLP759F version of the TLP559 SEMKO-approved DIP8 TLP2530 Dual-channel version of the 6N135 and the TLP550 DIP8 TLP2531 Dual-channel version of the 6N136 and the TLP550 IPM-Drive Photocouplers Part Number Pin Configuration SO6 (reinforced insulation) TLP104 IPM drive T opr SO8 IPM drive TLP2404 T opr ...

Page 23

... TLP701A* ± 0.6 A (max) TLP701H* TLP705A* TLP700 ± 2.0 A (max) TLP700H* ± 2.5 A (max) *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Propagation Delay Time Output Form/CTR Features (Max) 800 ns 25% ...

Page 24

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 25

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 26

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. SSOP4 SO6 2.54SOP4 2.54SOP6 TLP3230 TLP3130 TLP3250 TLP3131 TLP3231 TLP3203 TLP3100 TLP3213 TLP3113 TLP3216 ...

Page 27

... OFF * Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 28

... OFF Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 29

... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 30

... Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 31

... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 32

... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 33

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. R (Max ...

Page 34

... TLP168J 4000 Vrms 5000 Vrms 800 V 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. NZC: Non-zero cross ZC: Zero cross Triac-Output Photocouplers for Solid State Relays ( SSRs ) Part Number Pin Configuration ...

Page 35

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 36

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 37

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 38

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. MFSOP6 ...

Page 39

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. BVs ...

Page 40

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. Off-State ...

Page 41

... Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the “-“ character and/or using shorthand symbols. However, be sure to give full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative. ...

Page 42

Package Information 1 Lead Form Options for DIP Packages The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The electrical characteristics are identical, regardless of these options. Lead Form ...

Page 43

Package Dimensions ( 4-Pin DIP ) Standard DIP4 4.58 ± 0.25 7.62 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 7.85 to 8.80 2.54 ± 0.25 DIP4 (LF2 10.16 ± 0.25 ...

Page 44

Package Information 2 Package Dimensions ( 6-Pin DIP ) Standard DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 DIP6 (LF2 7.12 ± ...

Page 45

Package Dimensions ( 8-Pin DIP ) Standard DIP8 9.66 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 2.54 ± 0.25 DIP8 (LF2 9.66 ...

Page 46

Package Information 2 Package Dimensions ( Other DIP Packages ) 5-pin DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 5-pin DIP (with Pin 5 Cut ...

Page 47

Package Dimensions ( Surface Mount ) SDIP6 4.58 ± 0. 7.62 ± 0.25 1.27 ± 0.2 1.25 ± 0.2 0.4 ± 0.1 9.7 ± 0.3 4-pin MFSOP6 7.0 ± ...

Page 48

Package Information 2 Package Dimensions ( Surface Mount ) 2.54SOP4 3.9 ± 0.25 0.4 ± 0.1 2.54 ± 0.25 2.54SOP8 9.4 ± 0.25 2.54 ± 0.25 0.4 ...

Page 49

... Transistor-output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers are ranked according to their maximum I Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets. 1. CTR Rank Name and Rank Marking Available CTR Rank Selection ( ●: Available, ▲: Contact Toshiba) Part Number None GB ...

Page 50

Package Information 2. LED Trigger Current (I ) Ranking and Marking FT Rank Name I None I FT7 7 mA max I FT5 5 mA max I FT2 2 mA max 3. Marking Examples (a) 4-pin mini-flat 1-channel type ...

Page 51

Packing Information 1 Photocoupler Magazine Packing Specifications Magazine Dimensions Device Package Pin Count Quantities per Magazine Quantity (pcs Packing Dimensions A Number of Magazines Standard DIP DIPs with LF1, LF2, LF4 and LF5 Lead ...

Page 52

Packing Information Unit: mm SO6 10.5 4.8 Magazine Dimensions 4.7 Length = 555 Thickness = 0.5 Package 5 Device Pin Count (SO6) Quantities per Magazine Quantity (pcs) 125 B Packing Dimensions Package SO6 MFSOP6 SO8 Photocoupler Package Type MFSOP6 ...

Page 53

... Typical Devices TLP165J, TLP181, TLP190B TLP2105, TLP2108, TLP2405, TLP2408 TLP280, TLP281 TLP280-4, TLP281-4 TLP176G, TLP176A, TLP176D TLP197G TLP200D,TLP206A,TLP206G TLP3212 to 3217, TLP3230 to TLP3250 TLP701, TLP705, TLP719 TLP550, TLP560G TLP560G Unit: mm SDIP6 DIP ( LF1, LF5 ) SDIP6 F type ( TP15 ) ( TP1 ) , ( TP5 ) 2.35 ± 0.2 10.4 ± ...

Page 54

Packing Information 3. Reel Dimensions U E ø380 mm Photocoupler MFSOP, SO6 SO8 SOP4 Package Type ( TPL ) , ( TPR ) ( Tape Option ø380 ± ...

Page 55

... Labels with “ Please contact your TOSHIBA sales representative for details as to environmental matters such as the The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment ...

Page 56

Board Assembly 1 Example Land Patterns Below are the example land patterns for surface-mount packages. Mini-flat and SOP couplers 0.8 2.54 MFSOP6 (4-Pin) [e.g., TLP181] MFSOP6 (5-Pin) [e.g., TLP114A] 2.54SOP4 [e.g., TLP197G] SO6 (4-Pin) [e.g., TLP265J] 1.27 1.27 1.27 ...

Page 57

... Example of temperature profile of lead (Pb) solder c. Example of temperature profile of lead (Pb)-free solder The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets and databooks when mounting a device. (° ...

Page 58

... Projected Operating Life Based on LED Light Output Degradation Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on page 57 shows the types of LED used in photocouplers and the figures on pages show projections of long-term light output performance and operating life ...

Page 59

... TLP641 Series TLP525G Series 1 TLP651 TLP531 TLP700 TLP532 1 TLP701 TLP541G TLP702 1 1 TLP542G TLP705 TLP543J 1 TLP706 TLP545J TLP716 1 1 TLP550 TLP719 1 2 TLP551 TLP731 TLP552 2 TLP732 2 TLP553 2 TLP733 Series TLP554 2 2 TLP734 Series 1 TLP555 2 TLP741 Series 1 TLP557 2 TLP747 Series 1 TLP558 2 TLP750 Series ...

Page 60

Device Degradation GaAs LED Projected Light Output Degradation Data 1 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

Page 61

GaA As (SH) LED Projected Light Output Degradation Data Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

Page 62

Device Degradation GaA As (DH) LED Projected Light Output Degradation Data 3 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions: ...

Page 63

... GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs. These data are available for individual LEDs. Ask your local Toshiba sales representative ...

Page 64

Device Degradation Reading the Projected LED Operating Life Graph For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 60. Here is an example of how to read an operating life, ...

Page 65

... Safety Standard Approvals Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photore- lays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden). Safety Standard Approvals for Photocouplers Reflective Photocouplers in Mechanical Construction ...

Page 66

... Devices Triac/Thyrsitor Output The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. (DIN EN60747-5-2) (Continued) Single-Molded Packages Coupling Medium ...

Page 67

Photocoupler Application Circuit Examples 1 Digital Interface Applications High Speed TLP118, TLP2601 7 390 Ω LSTTL Low Input Current Drive TLP553 0 4.7 kΩ kΩ CMOS ...

Page 68

... Photocoupler Application Circuit Examples 2 Inverter and AC-DC Servo Applications [ Photo-IC couplers: high-speed base/gate drive applications ] GTR Direct Drive TLP109 / TLP2409 IGBT / TLP550 / TLP559 Power MOS Direct Drive TLP759 High-Speed (Numerical control, Robotics) Driving the Base of a 15-A-Class GTR ( Giant Transistor ) Module TLP557 ...

Page 69

Driving the Gate of a 50-A-Class IGBT Module TLP350 0.1 μ 390 Ω LSTTL Driving the Gate of a 400-A-Class IGBT Module TLP351/ TLP2541 8 1 0.1 μF ...

Page 70

Photocoupler Application Circuit Examples 3 Home Appliance Applications Electric Oven/Grills Magnetron Thermo-Switch Grill Heater Oven- TLP560G Cavity Lamp 120 Vac 50/60 Hz Door-Detector Circuit Weight Sensor Gas Sensor Refrigerator Block Diagram Panel Input Door Switch Temperature Sensor Door-Open Monitor ...

Page 71

Automatic Washing Machines M Drain Valve Water Supply Valve 100 Vac Fan Heaters (1)Block Diagram Panel Main Switch Adjustment Switches Display Speaker Room Temperature Sensor Preheat Sensor Earthquake Sensor TLP560G ...

Page 72

Photocoupler Application Circuit Examples 4 Home Appliance Applications (2)Waveform Examples 1. Example of Operating Waveform for Burner Motor Top: waveforms Medium: Bottom: Horizontal: Inverter Air Conditioners Remote Control Panel Microcontroller for Indoor Control Panel Unit Room Temperature Sensor Temperature ...

Page 73

Programmable Controller Applications DC Output for Sequencers TLP127 /TLP627 TLP225A /TLP222A Input for Sequencers 1 2 Limit Switches ● Thermostats ● Transducer ● DC-AC 3 Inputs 4 COMMON ...

Page 74

Photocoupler Application Circuit Examples 6 SSR and Power Control Circuit Applications Zero-Crossing Phototriac Output: TLP561G/TLP561J and Mini-Flat TLP161G/TLP166J TLP161G/ TLP561G/ TLP3042 ( S ) TLP166J / TLP561J / TLP3062 ( TLP3082 ( TLP3782 ...

Page 75

... TLP748J Note 1: EN60747-approved with option (D4) Note 2: The EN60747-5-2 safety standard for compact packages is different from those for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. *: Double protection Filter Switching ...

Page 76

Photocoupler Application Circuit Examples 8 Push-Button Telephone Application A variety of photocouplers are used to isolate between telephone lines (L1 and L2) and a CPU. Line Detector TLP629 TLP320 Application Package Type DIP4 TLP781 Ring ...

Page 77

Photovoltaic Coupler Applications TLP190B TLP590B TLP191B TLP591B Transformerless AC-DC converter TLP590B x n 100 Aac 10 Photorelays for Tester Application TLP3120 /TLP3122 /TLP3542 Power Source Timing Generator CPU Pattern Generator 11 Photorelay ( MOSFET Output ) Application L 1 ...

Page 78

... TLP280 TLP281 Half-Pitch Mini-Flat Coupler 13 Competitor Part Number Cross Reference Search The Toshiba Semiconductor webpage at http://www.semicon.toshiba.co.jp/eng/product/opto/selection/coupler/xref/index.html offers a cross reference search tool for photocouplers and photorelays. No need for output snubber circuit ● ● No need for reverse-blocking diode in input side Off-Hook Relay ...

Page 79

... MOC3043-M TLP3051 ( S ) TLP127 MOC3051-M TLP3052 ( S ) TLP627 MOC3052-M TLP3061 ( S ) TLP371 MOC3061-M TLP3062 ( S ) TLP372 MOC3062-M TLP3063 ( S ) TLP330 MOC3063-M 79 Avago Part Number Toshiba Part Number HCPL-M600 TLP118 HCPL-M601 TLP118 HCPL-M611 TLP118 HCPL-M452 TLP109 HCPL-M453 TLP109 HCPL-M456 TLP109 HCPL-2601 TLP2601 HCPL-2611 TLP2601 HCPL-2201 TLP555 HCPL-2530 ...

Page 80

... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise ...

Related keywords