TLP550 Toshiba, TLP550 Datasheet - Page 39

PHOTOCOUPLER HS TRANS-OUT 8DIP

TLP550

Manufacturer Part Number
TLP550
Description
PHOTOCOUPLER HS TRANS-OUT 8DIP
Manufacturer
Toshiba
Datasheets

Specifications of TLP550

Number Of Channels
1
Input Type
DC
Voltage - Isolation
2500Vrms
Current Transfer Ratio (min)
10% @ 16mA
Voltage - Output
15V
Current - Output / Channel
8mA
Current - Dc Forward (if)
25mA
Output Type
Transistor with Base
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Other names
TLP550(Y)
TLP5500

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Transistor-Output and Darlington-Transistor-Output Photocouplers (Continued)
Photocouplers for IGBT/MOSFET Gate Drive
*
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
TLP184*
TLP185*
TLP280
TLP281
TLP284
TLP285
TLP620
TLP620-2
TLP627
TLP627-2
TLP290-4*
TLP291-4*
TLP155E
Part Number
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
16
16
Pin Configuration
1
1
15
15
8
1
8
1
2
2
6
1
14
14
3
3
4
1
4
1
6
1
6
1
4
1
4
1
4
1
4
1
7
2
7
2
13
13
4
4
: Design which meets safety standard/approval pending as of January 2011
5
12
12
5
5
6
3
6
3
4
3
4
3
3
2
3
2
3
2
3
2
3
2
3
2
11
11
6
6
10
10
4
3
7
7
5
4
5
4
9
8
9
8
SO6 (reinforced insulation)
AC input
SO6 (reinforced insulation)
SOP4
Lead pitch = 1.27 mm
AC input
SOP4
Lead pitch = 1.27 mm
General-purpose
SEMKO-approved
SOP4 (reinforced insulation)
Lead pitch = 1.27 mm
Creepage/clearance ≥ 5 mm
Isolation thickness ≥ 0.4 mm
AC input
SOP4 (reinforced insulation)
Lead pitch = 1.27 mm
Creepage/clearance ≥ 5 mm
Isolation thickness ≥ 0.4 mm
SEMKO-approved
DIP4
Transistor output
AC input
SEMKO-approved
DIP8
Dual-channel version of
the TLP620
SEMKO-approved
DIP4
Darlington transistor output
High V
SEMKO-approved
DIP8
Dual-channel version of
the TLP627
SEMKO-approved
SO16
4-channel version
Lead pitch = 1.27 mm
AC input
SO16
4-channel version
Lead pitch = 1.27 mm
SO6 (reinforced Insulation)
T
Direct drive of a
small-power
IGBT/MOSFET
opr
= 100°C (max)
CEO
Features
Features
: Approved (reinforced insulation)
Propagation
Delay Time
39
300 V
300 V
80 V
80 V
80 V
80 V
80 V
80 V
55 V
55 V
V
80 V
80 V
0.2 μs
(Max)
CEO
@1 Minute
3750
Vrms
3750
Vrms
2500
Vrms
2500
Vrms
3750
Vrms
3750
Vrms
5000
Vrms
5000
Vrms
5000
Vrms
5000
Vrms
Vrms
Vrms
2500
2500
BVs
current (max):
Peak output
: Design which meets safety standard/approval pending as of January 2011
Output
±0.6 A
UL
7.5 mA
(Max)
I
FHL
c-UL
Vrms
3750
BVs
Safety Standards
UL/cUL TÜV
TÜV
/
(1)
(1)
(1)
(1)
(1)
Safety Standards
VDE
(1)
(1)
(1)
(1)
(1)
(1)
(2)
(2)
(2)
VDE
BSI
BSI
(2)
IEC
IEC

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