TLP550 Toshiba, TLP550 Datasheet - Page 8

• Manufacturer Part Number: TLP550
• Description: PHOTOCOUPLER HS TRANS-OUT 8DIP
• Manufacturer: Toshiba

Specifications of TLP550

• Number Of Channels: 1
• Input Type: DC
• Voltage - Isolation: 2500Vrms
• Current Transfer Ratio (min): 10% @ 16mA
• Voltage - Output: 15V
• Current - Output / Channel: 8mA
• Current - Dc Forward (if): 25mA
• Output Type: Transistor with Base
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Vce Saturation (max): -
• Current Transfer Ratio (max): -
• Other names: TLP550(Y); TLP5500

2
Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter
applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage
between input and output, as well as for international safety standards certification. Housed in the DIP4 package, the new photorelays
save board space and provide an isolation voltage of 5 kV. The TLP220 Series is available in versions with 60-V, 200-V, 350-V, 400-V
and 600-V peak off-state voltages. The TLP221A provides a 60-V peak off-state voltage and a 1.5-A on-state current.
*Under development. Specifications subject to change without notice.
Despite the same footprint size as the MFSOP6 package, the new SO6 package provides
reinforced insulation, offering clearance and creepage distances of ≥ 5 mm; an internal
isolation thickness of ≥ 0.4 mm; and an isolation voltage of 3750 Vrms.
Additionally, the SO6 features the maximum PCB mounted height of 2.3 mm, approximately
20% lower than the MFSOP6. This makes the photocouplers in SO6 ideal for low-profile
applications.
●
●
●
●
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
For the latest information, please contact your nearest Toshiba sales representative.
General-Purpose Photorelays Certified for Reinforced Insulation:
TLP220 Series and TLP221A (Under Development)
Package
Peak Off-State Voltage
(min)
On-State Current
(max)
On-State Resistance
(max)
Isolation Voltage
(min)
IC-Output Photocouplers in the SO6 Package Certified for Reinforced Insulation
Clearance/creepage: ≥ 5 mm
Thin package: ≤ 2.3 mm
Internal Faraday shield: ≥ 0.4 mm
Thin package: ≤ 2.3 mm
Part Number
TLP104
TLP109
TLP116A
TLP2366*
TLP118
TLP2368*
TLP2367*
Characteristic
New Products
Data rate
20 Mbit/s
20 Mbit/s
50 Mbit/s
1 Mbit/s
1 Mbit/s
(typ.)
Symbol
V
R
B
I
−
OFF
ON
ON
VS
Open-collector, optimized for IPM drive
Open-collector
Totem-pole inverting logic
Open-collector inverting logic
Totem-pole inverting logic
Vrms
Unit
Ω
−
V
A
Existing Photorelay Examples
TLP222A
Output
5000
0.5
60
2
TLP222G
5000
0.12
350
50
Supply voltage
TLP220A
4.5 V to 30 V
4.5 V to 30 V
8
5000
3.3 V/5 V
3.3 V/5 V
3.3 V/5 V
0.5
60
2
5 V
5 V
TLP220D
5000
0.25
200
Input Threshold
8
Current (max)
5 mA
5 mA
5 mA
5 mA
5 mA
5 mA
DIP4
−
TLP220G
Under Development
5000
350
0.1
50
Scheduled for mass production in June to August
TLP220GA
5000
0.12
400
35
2.3
TLP220J
5000
0.09
600
60
TLP221A
5000
1.5
0.2
60
SO6
SO6