TLP550 Toshiba, TLP550 Datasheet - Page 9

• Manufacturer Part Number: TLP550
• Description: PHOTOCOUPLER HS TRANS-OUT 8DIP
• Manufacturer: Toshiba

Specifications of TLP550

• Number Of Channels: 1
• Input Type: DC
• Voltage - Isolation: 2500Vrms
• Current Transfer Ratio (min): 10% @ 16mA
• Voltage - Output: 15V
• Current - Output / Channel: 8mA
• Current - Dc Forward (if): 25mA
• Output Type: Transistor with Base
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Vce Saturation (max): -
• Current Transfer Ratio (max): -
• Other names: TLP550(Y); TLP5500

Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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●
●
●
●
●
●
●
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC