MT72HTS1G72PY-53EE1 Micron Technology Inc, MT72HTS1G72PY-53EE1 Datasheet - Page 7

• Manufacturer Part Number: MT72HTS1G72PY-53EE1
• Description: MODULE DDR2 8GB 240-RDIMM
• Manufacturer: Micron Technology Inc

Specifications of MT72HTS1G72PY-53EE1

• Memory Type: DDR2 SDRAM
• Memory Size: 8GB
• Speed: 533MT/s
• Package / Case: 240-RDIMM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Specifications
Table 6:
Input Capacitance
Component Timing and Operating Conditions
Table 7:
PDF: 09005aef82d283a8/Source: 09005aef82d28271
HTS72C1Gx72.fm - Rev. A 8/07 EN
V
V
Symbol
DD
IN
I
VREF
T
, V
I
/
T
OZ
V
I
C
I
A
1
DD
OUT
Q
Absolute Maximum Ratings
Module and Component Speed Grades
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
under test = 0V)
Output leakage current; 0V ≤ V
and ODT are disabled
V
Module ambient operating temperature
DDR2 SDRAM component case operating
temperature
REF
REF
DD
/
Module Speed Grade
Notes:
V
input 0V ≤ V
leakage current; V
DD
Q supply voltage relative to V
2
Stresses greater than those listed in Table 6 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions outside those indicated in each device’s data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
1. The refresh rate is required to double when 85°C < T
2. For further information, refer to technical note
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades as shown in Table 7.
-667
-53E
-40E
on Micron’s Web site.
IN
≤ 0.95V (All other pins not
REF
=
V
alid V
OUT
SS
≤ V
REF
SS
DD
level
IN
8GB (x72, ECC, QR) 240-Pin DDR2 SDRAM RDIMM
Q; DQs
≤ V
DD
7
;
Address inputs
RAS#, CAS#, WE#, S#,
CKE, ODT, BA
CK, CK#
DQ, DQS, DQS#
Commercial
Industrial
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
TN-00-08: Thermal Applications,
C
≤ 95°C.
Electrical Specifications
-37E
-5E
-3
–250
–144
Min
–0.5
–0.5
–10
–20
–40
–40
©2007 Micron Technology, Inc. All rights reserved.
0
0
+250
+144
Max
+2.3
+2.3
+10
+20
+70
+85
+85
+95
available
Units
µA
µA
µA
°C
°C
°C
°C
V
V