■
■
■
High Brightness Type Chip LEDs with reflector
Note) "-" will be taken out for emitting color B/E series.
* I
The recommended thickness of the screen mask
for soldering is between 100 and 200μm. The
hole size of the screen mask should be same as
the recommended land pattern or smaller.
SML010BAT
SML011BBT
SML012BCT
SML011EBT
SML012ECT
SML-011YT
SML-012YT
SML-011DT
SML-012DT
SML-011UT
SML-012UT
SML010BAT
SML011BBT
SML012BCT
SML011EBT
SML012ECT
SML-011YT
SML-012YT
SML-011DT
SML-012DT
SML-011UT
SML-012UT
SML-01* Series
FP
Part No.
Part No.
Recommemded Pad Layout
Package Size
Absolute Maximum Ratings(Ta=25℃)
Electrical Optical Characteristics(Ta=25℃)
SURFACE MOUNT LED LAMPS
measured under duty ≦1/10,1kHz.
3.0×2.0
(mm)
( 1206 )
t=1.3
3216
1.6
Transparent
Resin Color
Emitting
Orange
Yellow
Green
color
Blue
Red
Clear
GaN on SiC
SML010BAT SML011BBT SML012BCT SML011EBT SML012ECT SML-011YT SML-012YT SML-011DT SML-012DT SML-011UT SML-012UT
(Unit:mm)
428nm
dissipation
(mW)
Typ.
3.8
3.5
3.8
2.0
( V )
Power
Forward
voltage
P
94
84
75
D
V
F
( mA )
20
I
F
Forward
(mA)
current
Blue
■
20
30
I
Max.
(µ A )
Tape Spacifications:T86〈2,500pcs/reel〉
F
100
10
Reverse
current
Packaging Spacifications(Unit:mm)
468nm
I
R
(mA)
forward
current
( V )
V
Peak
*I
5
100
100
R
70
FP
InGaN on SiC
Peak Half-wave
( nm )
Light wavelength
Typ.
428
468
523
518
590
611
630
λp
2
Reverse
voltage
(V)
4
V
5
( nm )
Typ.
R
∆λ
65
26
36
35
15
17
18
temperature
( mA )
-40 to +100
525nm
Operating
Green
-30 to +85
20
I
(°C)
F
T
opr
Feeding direction
(
Min.
mcd
140
3.6
22
36
56
22
36
22
36
22
36
Brightness
)
temperature
( mcd )
-40 to +100
-40 to +100
Typ.
100
140
360
100
140
100
36
63
63
63
I
Stotage
9
(°C)
V
T
φ1.5
stg
2.4
( mA )
20
I
F
590nm
Yellow
■
■
Tolerance:±0.1
X’
External Dimensions(Unit:mm)
Directivity
1.6
90°
Y’
100
Terminal
AlGaInP on GaAs
60°
Orange
611nm
30°
50
Cathode mark
Relative brightness ( % )
Reel Spacifications
3.0
2.3
1.6
0°
0
2−R0.3
φ180
φ60
0.3
50
30°
1.3
φ13
630nm
−0.1
+0.2
Red
60°
0.5
100
90°
( Typ. )