ATH016A0X3-SRZ Lineage Power, ATH016A0X3-SRZ Datasheet - Page 20
![CONVE DC/DC 0.75 3.63V @ 16A SMD](/photos/8/70/87083/ath016a0x3-srz_sml.jpg)
ATH016A0X3-SRZ
Manufacturer Part Number
ATH016A0X3-SRZ
Description
CONVE DC/DC 0.75 3.63V @ 16A SMD
Manufacturer
Lineage Power
Series
Austin SuperLynx™ IIr
Type
Point of Load (POL) Non-Isolated with Remote On/Offr
Datasheet
1.ATH016A0X3-SRZ.pdf
(21 pages)
Specifications of ATH016A0X3-SRZ
Output
0.75 ~ 3.63V
Number Of Outputs
1
Power (watts)
58W
Mounting Type
Surface Mount
Voltage - Input
2.4 ~ 5.5V
Package / Case
7-SMD Module
1st Output
0.75 ~ 3.63 VDC @ 16A
Size / Dimension
1.30" L x 0.53" W x 0.33" H (33mm x 13.5mm x 8.3mm)
Power (watts) - Rated
58W
Operating Temperature
-40°C ~ 85°C
Efficiency
95%
Approvals
CSA, EN, UL, VDE
Output Power
58 W
Input Voltage Range
2.4 V to 5.5 V
Output Voltage (channel 1)
0.75 V to 3.63 V
Output Current (channel 1)
16 A
Package / Case Size
SMD
Output Type
Non-Isolated
Output Voltage
0.75 V to 3.63 V
Output Current
16A
Input Voltage
2.4 to 5.5V
Screening Level
Industrial
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
85C
Product Length (mm)
33mm
Product Depth (mm)
13.5mm
Product Height (mm)
6.69mm
Mounting Style
Surface Mount
Pin Count
7
Product
Non-Isolated / POL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
555-1089-2
CC109104551
CC109104551
Data Sheet
October 2, 2009
Surface Mount Information
Lead Free Soldering
The –Z version Austin SuperLynx II SMT modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 37.
MSL Rating
The Austin SuperLynx II SMT modules have a MSL
rating of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
LINEAGE
POWER
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 16A output current
(continued)
Austin Superlynx
Figure 37. Recommended linear reflow profile
using Sn/Ag/Cu solder.
300
250
200
150
100
50
TM
0
Per J-STD-020 Rev. C
II SMT Non-isolated Power Modules:
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
20