XLT28QFN4 Microchip Technology, XLT28QFN4 Datasheet - Page 17

• Manufacturer Part Number: XLT28QFN4
• Description: SOCKET TRANS ICE 28QFN W/CABLE
• Manufacturer: Microchip Technology

Specifications of XLT28QFN4

• Module/board Type: *
• Convert From: 28-DIP
• Convert To: 28-QFN
• Pitch Spacing: 0.025"
• Svhc: No SVHC (15-Dec-2010)
• Ic Adapter Type: Transition Socket
• Mounting Type: Through Hole
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: MPLAB™ICE
• For Use With: AC162067 - HEADER INTRFC MPLAB ICD2 40/28PDAF18-4 - DEVICE ADAPTER FOR ICE4000DAF30-4 - DEVICE ATP FOR ICE4000DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets and
associated hardware are shown below.
FIGURE 4: QFP TRANSITION SOCKET
The QFP transition socket is required for use along with
the QFP device adapter. The device adapter is
equipped with four socket strips that interface with the
transition socket.
There are two parts to the QFP transition socket:
1.
2.
Microchip offers the following QFP transition sockets:
• XLT44PT3: One 44-lead QFP adapter socket and
• XLT64PT5: One 64-lead QFP adapter socket and
• XLT80PT2: One 80-lead QFP adapter socket and
• XLT80PT3: One 80-lead QFP adapter socket and
See the drawings in this section for layout dimensions
and clearances for tall components.
 2010 Microchip Technology Inc.
Note:
one 44-lead QFP header (0.8 mm)
one 64-lead QFP header (0.5 mm)
one 80-lead QFP header (0.65 mm)
one 80-lead QFP header (0.5 mm)
Adapter socket that connects to the QFP device
adapter
QFP header that gets soldered down to the
target application
To avoid solder bridging, do not place vias
within 0.025-inch of the QFP footprint.
Also, any vias near the QFP should be
directly on the centerline of the pad.
QFP Transition Socket
QFP Device Adapter
Cable to Processor Module
Target/Application Board
Transition Socket Specification
QFP TRANSITION SOCKET
SOLDERING TIPS
• Use controlled soldering iron tip temperatures
• If possible, use a PACE mini wave soldering iron
• Plan to solder one (1 of 4) side first, then the
• Soldering iron tip movement should be in the
• Use generous amounts of soldering flux to aid in
between 300C and 325C (570F to 615F)
tip or an equivalent tip design.
opposite side, then the remaining two sides.
direction of the leads (backward and forward), not
across the leads; dragging the tip across the
leads may cause lead damage.
the solder flow action.
DS51194S-page 17