XLT28SO-1 Microchip Technology, XLT28SO-1 Datasheet - Page 4

• Manufacturer Part Number: XLT28SO-1
• Description: SOCKET TRANSITION 28SOIC 300MIL
• Manufacturer: Microchip Technology

Specifications of XLT28SO-1

• Module/board Type: *
• Svhc: No SVHC (15-Dec-2010)
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: MPLAB™ICE
• For Use With: AC162067 - HEADER INTRFC MPLAB ICD2 40/28PDAF18-4 - DEVICE ADAPTER FOR ICE4000DAF30-4 - DEVICE ATP FOR ICE4000DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LDDVA16XP280 - ADAPTER DEVICE FOR MPLAB-ICEICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers.
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
Care should be taken when soldering some transition
sockets to target boards. See the releated section for
specific instructions.
For information on packaging dimensions, please refer
to the Packaging Specification (DS00049).
DS51194S-page 4
GLOSSARY
Terms used in this document:
DFN – Dual Flat No lead
DIP – Dual In-line Package
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
 2010 Microchip Technology Inc.