XLT18SO-1 Microchip Technology, XLT18SO-1 Datasheet - Page 25

• Manufacturer Part Number: XLT18SO-1
• Description: SOCKET TRANSITION 18SOIC 300MIL
• Manufacturer: Microchip Technology

Specifications of XLT18SO-1

• Module/board Type: *
• Svhc: No SVHC (15-Dec-2010)
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: MPLAB™ICE
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14DVA1006 - DEVICE ADAPTER ICE2000 18DIPDVA1001 - ADAPTER FOR PIC16F716 18DIPDAF18-4 - DEVICE ADAPTER FOR ICE4000DAF30-4 - DEVICE ATP FOR ICE4000AC162054 - HEADER INTERFACE ICD2 16F716DVA18XP180 - DEVICE ADAPTER 18F1320 PDIP 18LDAC162053 - HEADER INTERFACE ICD,ICD2 18DIPDVA16XP185 - ADAPTER DEVICE ICE 18DIP/SOICDVA16XP183 - ADAPTER ICE 18DIP/SOIC/SSOPDVA16XP182 - ADAPTR 712,716 DIP,SOIC,SSOPDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

XLT20QFN-1 Soldering Suggestions
This socket is difficult to solder since the device pins
are not exposed, but embedded, into the socket’s
Surface Foot (SF).
1.
2.
3.
4.
5.
You are now ready to attach the QFN header to the SF.
 2010 Microchip Technology Inc.
To start, add tack flux to the target land pattern.
Visually align the QFN SF with the target land
pattern. Then solder two opposite SF pins to the
target lands so that the SF does not move
around.
Finish soldering the rest of the SF pins.
If the SF has a middle ground pin, feed solder
through the bottom side of hte target board via
holes. This will connect the center QFN SF pin
to the target board.
Check each solder connection on the QFN SF
pins.
Transition Socket Specification
DS51194S-page 25