C8051T610DB24 Silicon Laboratories Inc, C8051T610DB24 Datasheet - Page 28

• Manufacturer Part Number: C8051T610DB24
• Description: DAUGHTER BOARD T610 24QFN SOCKET
• Manufacturer: Silicon Laboratories Inc

Specifications of C8051T610DB24

• Module/board Type: Socket Module - QFN
• Processor To Be Evaluated: C8051T61x
• Interface Type: USB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051T610DK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 336-1507

C8051T610/1/2/3/4/5/6/7
28
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 3x3 array of 0.90mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume.
Small Body Components.
Figure 5.2. QFN-28 Recommended PCB Land Pattern
Table 5.2. QFN-28 PCB Land Pattern Dimesions
0.20
Min
4.80
4.80
0.50
Max
0.30
Rev 1.0
Dimension
X2
Y1
Y2
3.20
0.85
3.20
Min
Max
3.30
0.95
3.30