C8051T610DB24 Silicon Laboratories Inc, C8051T610DB24 Datasheet - Page 30

DAUGHTER BOARD T610 24QFN SOCKET

C8051T610DB24

Manufacturer Part Number
C8051T610DB24
Description
DAUGHTER BOARD T610 24QFN SOCKET
Manufacturer
Silicon Laboratories Inc
Datasheet

Specifications of C8051T610DB24

Module/board Type
Socket Module - QFN
Processor To Be Evaluated
C8051T61x
Interface Type
USB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
C8051T610DK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
336-1507
C8051T610/1/2/3/4/5/6/7
30
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10mm x 1.10mm openings on a 1.30mm pitch should be used for the center
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
pad.
Small Body Components.
Figure 6.2. QFN-24 Recommended PCB Land Pattern
Table 6.2. QFN-24 PCB Land Pattern Dimesions
3.90
3.90
0.20
Min
0.50 BSC
Max
4.00
4.00
0.30
Rev 1.0
Dimension
X2
Y1
Y2
2.70
0.65
2.70
Min
Max
2.80
0.75
2.80

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