KIT33887EKEVBE Freescale Semiconductor, KIT33887EKEVBE Datasheet - Page 34
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KIT33887EKEVBE
Manufacturer Part Number
KIT33887EKEVBE
Description
BOARD EVALUATION FOR MC33887
Manufacturer
Freescale Semiconductor
Type
Charge Pumpsr
Specifications of KIT33887EKEVBE
Main Purpose
Power Management, H Bridge Driver (Internal FET)
Embedded
No
Utilized Ic / Part
MC33887
Primary Attributes
5A, 5 ~ 28V, PWM to 20kHz, Active Current Limit
Secondary Attributes
Fault Status, Sleep Mode, Proportional Current Mirror Output
Input Voltage
8 V to 20 V
Board Size
50.8 mm x 50.8 mm
Maximum Operating Temperature
+ 85 C
Product
Power Management Modules
Dimensions
50.8 mm x 50.8 mm
Silicon Manufacturer
Freescale
Silicon Core Number
MC33887
Kit Application Type
Power Management - Motor Control
Application Sub Type
DC Brushed Motor
Kit Contents
Board, CD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
MC33887
Device on Thermal Test Board
34
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
AGND
PGND
PGND
OUT1
OUT1
IN1
FS
V+
V+
FB
12.2 mm x 6.9 mm Exposed Pad
33887 Pin Connections
1
2
3
4
5
6
7
8
9
10
16.0 mm x 11.0 mm Body
20-Pin HSOP-EP
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat spreading areas on board
surface
Natural convection, still air
1.27 mm Pitch
Tab
Tab
20
19
18
17
16
15
14
13
12
11
EN
IN2
D1
C
V+
OUT2
OUT2
D2
PGND
PGND
Figure 26. Thermal Test Board
CP
Table 8.
ambient air.
reference location on the board surface near a center lead of the
package (see
Thermal Resistance
R
R
θ
θ
JA
JS
is the thermal resistance between die junction and
is the thermal resistance between die junction and the
R
R
θ
θ
JA
JS
Thermal Resistance Performance
Figure
A
26).
Analog Integrated Circuit Device Data
Area A (mm
300
600
300
600
0.0
0.0
Freescale Semiconductor
2
)
°C/W
7.0
6.0
52
36
32
10