ATSAM3U-EK Atmel, ATSAM3U-EK Datasheet - Page 1145
ATSAM3U-EK
Manufacturer Part Number
ATSAM3U-EK
Description
KIT EVAL FOR AT91SAM3U CORTEX
Manufacturer
Atmel
Type
MCUr
Datasheets
1.ATSAM3U-EK.pdf
(2 pages)
2.ATSAM3U-EK.pdf
(61 pages)
3.ATSAM3U-EK.pdf
(1171 pages)
4.ATSAM3U-EK.pdf
(53 pages)
Specifications of ATSAM3U-EK
Contents
Board
Processor To Be Evaluated
SAM3U
Data Bus Width
32 bit
Interface Type
RS-232, USB
Operating Supply Voltage
3 V
Silicon Manufacturer
Atmel
Core Architecture
ARM
Core Sub-architecture
Cortex - M3
Silicon Core Number
SAM3U4E
Silicon Family Name
SAM3U
Kit Contents
Board CD Docs
Rohs Compliant
Yes
For Use With/related Products
AT91SAM3U
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ATSAM3U-EK
Manufacturer:
Atmel
Quantity:
10
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44.3
Figure 44-3. 144-lead LQFP Package Drawing
Notes:
Table 44-8.
Table 44-9.
Table 44-10. Package Reference
6430D–ATARM–25-Mar-11
TBD
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
144-lead LQFP Package
1. This drawing is for general information only; refer to JEDEe Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum
4. b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between pro-
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
plastic body size dimensions including mold mismatch.
trusion and an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
Device Maximum Weight
144-lead Package Characteristics
mg
3
MS-026
e3
SAM3U Series
1145
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