R0K521276S001BE Renesas Electronics America, R0K521276S001BE Datasheet - Page 4

• Manufacturer Part Number: R0K521276S001BE
• Description: KIT STARTER FOR R8C/27
• Manufacturer: Renesas Electronics America
• Series: Renesas Starter Kits (RSK)r
• Type: MCUr

Specifications of R0K521276S001BE

• Contents: CPU Board, LCD Display Module, E8 Emulator, Cable, QuickStart Guide and CD-ROM
• Silicon Manufacturer: Renesas
• Features: Coding And Debugging, E8A Emulator, RS232 Serial Connection
• Kit Contents: Board
• Silicon Family Name: R8C/27
• Silicon Core Number: R5F21276SNFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: R8C/27
• Lead Free Status / Rohs Status: Compliant

Table of Contents
Chapter 1. Preface .................................................................................................................................................. 1
Chapter 2. Purpose ................................................................................................................................................. 2
Chapter 3. Power Supply ........................................................................................................................................ 3
Chapter 4. Board Layout ......................................................................................................................................... 4
Chapter 5. Block Diagram ....................................................................................................................................... 6
Chapter 6. User Circuitry......................................................................................................................................... 7
Chapter 7. Modes.................................................................................................................................................. 14
Chapter 8. Programming Methods........................................................................................................................ 15
Chapter 9. Headers............................................................................................................................................... 16
Chapter 10. Code Development ........................................................................................................................... 19
Chapter 11. Component Placement...................................................................................................................... 21
Chapter 12. Additional Information ....................................................................................................................... 22
3.1. Requirements ............................................................................................................................................... 3
3.2. Power – Up Behaviour ................................................................................................................................. 3
4.1. Component Layout ....................................................................................................................................... 4
4.2. Board Dimensions ........................................................................................................................................ 5
6.1. Switches ....................................................................................................................................................... 7
6.2. LEDs ............................................................................................................................................................. 7
6.3. Potentiometer ............................................................................................................................................... 7
6.4. Serial port ..................................................................................................................................................... 8
6.5. LCD Module.................................................................................................................................................. 8
6.6. Option Links.................................................................................................................................................. 9
6.7. Oscillator Sources ...................................................................................................................................... 13
6.8. Reset Circuit ............................................................................................................................................... 13
6.9. LIN Interface ............................................................................................................................................... 13
7.1. Boot mode .................................................................................................................................................. 14
7.2. Single chip mode ........................................................................................................................................ 14
9.1. Microcontroller Headers ............................................................................................................................. 16
9.2. Application Headers ................................................................................................................................... 17
10.1. Overview................................................................................................................................................... 19
10.2. Mode Support ........................................................................................................................................... 19
10.3. Breakpoint Support................................................................................................................................... 19
10.4. Memory Map............................................................................................................................................. 20
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