TLP227A(F) Toshiba, TLP227A(F) Datasheet - Page 42
![PHOTORELAY MOSFET OUT 4-DIP](/photos/9/60/96027/tlp227a_f__sml.jpg)
TLP227A(F)
Manufacturer Part Number
TLP227A(F)
Description
PHOTORELAY MOSFET OUT 4-DIP
Manufacturer
Toshiba
Series
TLP227Ar
Specifications of TLP227A(F)
Circuit
SPST-NO (1 Form A)
Output Type
AC, DC
On-state Resistance
2 Ohm
Load Current
500mA
Voltage - Input
1.15VDC
Voltage - Load
0 ~ 60 V
Mounting Type
Through Hole
Termination Style
PC Pin
Package / Case
4-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP227AF
6
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Example 1: Standard part: TLP620(F)
1
Package Information
Lead Form Options for DIP Packages
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
Carrier Tape Code
Package Outlines
Lead Form Code
See the TLP781, TLP785 datasheet.
Appearance
Lead Form
6-pin DIP
4-pin DIP
6
1 2
Dimensions
All other package dimensions are the same as for each standard package
specification.
Dimension
4 3
1
5
2
(TP1)
(LF1)
4
3
A
B
C
Version
16
1
8
1
Min
6.4
16-pin DIP
8-pin DIP
–
(0.35 typ.)
(LF1)
42
Surface-Mount
Max
10.0
5
–
4
(TP4)
(LF4)
9
8
Min
8.0
–
(0.25 typ.)
B
(LF4)
Max
12.0
–
Min
6.4
–
–
* Tape-and-reel packing is not available with (LF2).
(LF5)
(TP5)
A
C
(LF5)
Unit: mm
Max
10.0
0.2
–
Not available*
Wide-Spaced
10 to 12
(LF2)
10.16