VJ2225Y104KBLAT4X Vishay, VJ2225Y104KBLAT4X Datasheet - Page 14

CAP CER .1UF 10% 630V X7R 2225

VJ2225Y104KBLAT4X

Manufacturer Part Number
VJ2225Y104KBLAT4X
Description
CAP CER .1UF 10% 630V X7R 2225
Manufacturer
Vishay
Series
VJr
Datasheet

Specifications of VJ2225Y104KBLAT4X

Capacitance
0.1µF
Voltage - Rated
630V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
Boardflex Sensitive
Package / Case
2522 (6456 Metric) Wide, 2225 (5664 Metric)
Size / Dimension
0.220" L x 0.250" W (5.59mm x 6.35mm)
Thickness
2.18mm Max
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
BOARDFLEX SENSITIVE APPLICATIONS - SOLUTION:
A predominant failure mode in multilayer ceramic chip capacitors is cracking caused by board flexure. Cracks can then create
a path for current to pass from one electrode through the dielectric to an opposing electrode or from the terminations at one
end of the MLCC through the dielectric to an opposing electrode. This may subsequently result in capacitance loss, leakage -
low Insulation Resistance (IR) - and/or more seriously, high current shorts. A short circuit condition in the surface mounted
capacitors can cause further failures of downstream components. Vishay’s Open Mode Design Capacitors (VJ OMD - Cap.
series) reduce the risk of these destructive conditions through MLCC designs that prevent board flexure cracks reaching the
opposing electrode.
VJ OMD - Cap. MLCCs reduce the risk of early field failures associated with board flex cracks. However, it is important to note
that even in the open mode designs the presence of flexure related cracks can cause capacitance loss leading to localized
stresses on the parts. eventually, depending on the application environment, including such factors and high voltage pulse
frequency and thermal cycling this may lead to internal breakdown of the component.
POLYMER TERMINATION
Polymer termination provides additional protection against board flexure damage by absorbing greater mechanical and thermal
stresses. Components can be packaged, transported, stored and handled the same standard terminated product. Wave and
reflow soldering of MLCC does not require modification to equipment and/or process. Polymer termination greatly reduces the
risk of mechanical cracking however it does not completely eliminate.
Document Number: 45198
Revision: 25-Jan-11
STANDARD TERMINATION
Exposed Electrodes = Electrical short
Surface Mount Multilayer Ceramic Chip Capacitor
Solutions for Boardflex Sensitive Applications
100 %
80 %
70 %
60 %
50 %
40 %
30 %
20 %
10 %
90 %
0 %
0.0
For technical questions, contact:
TYPICAL BEND TEST RESULTS 2220 CASE SIZE
1.0
Standard Termination
Polymer Termination
Log. (Standard Termination)
Log. (Polymer Termination)
2.0
BOARD FLEXURE in (mm)
3.0
4.0
5.0
OMD CAP PLUS POLYMER TERMINATION
No Exposed Electrodes = No Electrical short
mlcc@vishay.com
6.0
7.0
8.0
9.0
VJ OMD Series
Vishay Vitramon
www.vishay.com
121

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