QMK316B7473ML-T Taiyo Yuden, QMK316B7473ML-T Datasheet - Page 15
Manufacturer Part Number
CAP CERM 47000PF 250V X7R 1206
Specifications of QMK316B7473ML-T
Voltage - Rated
Surface Mount, MLCC
-55°C ~ 125°C
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
CG QMK316 B7473ML-T
Precautions on the use of Multilayer Ceramic Capacitors
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（Design of Land-patterns）
Veriﬁcation of operating environment, electrical rating and per-
1. A malfunction in medical equipment, spacecraft, nuclear
Operating Voltage （Veriﬁcation of Rated voltage）
1. The operating voltage for capacitors must always be lower
2. Even if the applied voltage is lower than the rated value, the
1. When capacitors are mounted on a PCB, the amount of
（1） The amount of solder applied can affect the ability of
（2） When more than one part is jointly soldered onto the
reactors, etc. may cause serious harm to human life or have
severe social ramiﬁcations. As such, any capacitors to be
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
solder used （size of ﬁllet） can directly affect capacitor per-
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and conﬁguration of the solder pads which in
turn determines the amount of solder necessary to form
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
1.The following diagrams and tables show some examples of recommended patterns to
Recommended land dimensions for wave-soldering （unit: mm）
Recommended land dimensions for reﬂow-soldering （unit: mm）
Excess solder can affect the ability of chips to withstand mechanical stresses. There-
fore, please take proper precautions when designing land-patterns.
prevent excessive solder amourts. （ larger ﬁllets which extend above the component
Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip capacitor land patterns for PCBs
212 （2 circuits） 110（2 circuits） 096（2 circuits）
212 （4 circuits）
0.15∼0.25 0.20∼0.30 0.45∼0.55 0.8∼1.0 0.8∼1.2 1.8∼2.5 1.8∼2.5 2.5∼3.5
0.10∼0.20 0.20∼0.30 0.40∼0.50 0.6∼0.8 0.8∼1.2 1.0∼1.5 1.0∼1.5 1.5∼1.8
0.15∼0.30 0.25∼0.40 0.45∼0.55 0.6∼0.8 0.9∼1.6 1.2∼2.0 1.8∼3.2 2.3∼3.5
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