MC33262 MULTICOMP, MC33262 Datasheet
MC33262
Manufacturer Part Number
MC33262
Description
Heat Sink
Manufacturer
MULTICOMP
Datasheet
1.MC33261.pdf
(1 pages)
Specifications of MC33262
Packages Cooled
TO-218 / TO-220
Thermal Resistance
12.9°C/W
Width
16.6mm
Height
38.1mm
Length
16.26mm
Mounting Type
PC Board Thru Hole
Package / Case
TO-218, TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33262
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
MC33262CDR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC33262D
Manufacturer:
ON Semiconductor
Quantity:
3
Company:
Part Number:
MC33262DG
Manufacturer:
ON Semiconductor
Quantity:
43
Part Number:
MC33262DG
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC33262DR2
Manufacturer:
DALLAS
Quantity:
3 002
Part Number:
MC33262DR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Heatsink Extruded
Mfg Part No:
MC33261
MC33262
Flat back, vertical mounting extruded heatsink with solderable
fixing pins. Pre-drilled for a single TO218/TO220 package.
Product Features:
•
•
•
http://www.farnell.com
http://www.newark.com
http://www.cpc.co.uk
Small PCB footprint
Solderable mounting pins
Black anodize finish
MC33261
Thermal Resistance:
16.7
12.9
o
o
C/W
C/W
P
a
Height (mm):
25.4
38.1
g
e
<
1
>
MC33262
B (mm):
18.29
18.29
2
2
1 /
0
0 /
8
V
1
1 .
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