74HC2G32 Philips, 74HC2G32 Datasheet

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74HC2G32

Manufacturer Part Number
74HC2G32
Description
Dual 2-input OR gate
Manufacturer
Philips
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
74HC2G32DP
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Product specification
Supersedes data of 2002 Jul 17
DATA SHEET
74HC2G32; 74HCT2G32
Dual 2-input OR gate
INTEGRATED CIRCUITS
2003 Oct 30

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74HC2G32 Summary of contents

Page 1

... DATA SHEET 74HC2G32; 74HCT2G32 Dual 2-input OR gate Product specification Supersedes data of 2002 Jul 17 INTEGRATED CIRCUITS 2003 Oct 30 ...

Page 2

... Volts total load switching outputs sum of outputs For 74HC2G32: the condition is V For 74HCT2G32: the condition is V 2003 Oct 30 DESCRIPTION The 74HC2G/HCT2G32 is a high-speed Si-gate CMOS device. The 74HC2G/HCT2G32 provides the dual 2-input OR function. 6.0 ns. CONDITIONS ...

Page 3

... PINS RANGE SYMBOL data input 1A data input 1B data output 2Y ground (0 V) data input 2A data input 2B data output 1Y supply voltage 3 Product specification 74HC2G32; 74HCT2G32 OUTPUT nY PACKAGE PACKAGE MATERIAL CODE TSSOP8 plastic SOT505-2 TSSOP8 plastic SOT505-2 VSSOP8 plastic SOT765-1 VSSOP8 ...

Page 4

... MNA Fig.3 IEC logic symbol. 2003 Oct handbook, halfpage handbook, halfpage 3 4 Product specification 74HC2G32; 74HCT2G32 MNA733 Fig.2 Logic symbol Fig.4 Logic diagram (one driver). Y MNA166 ...

Page 5

... 6 CONDITIONS V < 0 > < 0 0.5 V < V < note 1 for temperature range from 40 to +125 C; note 2 derates linearly with 8 mW/ 74HC2G32; 74HCT2G32 74HC2G32 74HCT2G32 TYP. MAX. MIN. TYP. 5.0 6.0 4.5 5 +25 +125 40 +25 1000 6.0 500 6 ...

Page 6

... I = 4 5 4 5 GND 6 GND; 6 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. 1.5 1.2 V 3.15 2.4 V 4.2 3.2 V 0.8 0.5 V 2.1 1.35 V 2.8 1.8 V 1.9 2.0 V 4.4 4.5 V 5.9 6.0 V 4.18 4.32 V 5. 0.1 V 0.15 0.26 V 0.16 0.26 V ...

Page 7

... I = 4 5 4 5 GND 6 GND; 6 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. 1.5 V 3.15 V 4.2 V 0.5 V 1.35 V 1.8 V 1.9 V 4.4 V 5.9 V 4.13 V 5.63 V 0.1 V 0.1 V 0.1 V 0.33 V 0.33 V 1.0 10 UNIT A A ...

Page 8

... I = 4 5 4 5 GND 6 GND; 6 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. 1.5 V 3.15 V 4.2 V 0.5 V 1.35 V 1.8 V 1.9 V 4.4 V 5.9 V 3.7 V 5.2 V 0.1 V 0.1 V 0.1 V 0.4 V 0.4 V 1.0 20 UNIT A A ...

Page 9

... A 4 4 4 GND 5 GND 4 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. (V) 2.0 1.6 1.2 0.8 4.4 4.5 4.18 4.32 0 0.1 0.15 0.26 0.1 1.0 300 2.0 0.8 4.4 4.13 0.1 0.33 1.0 10 375 UNIT ...

Page 10

... 4 4 4 GND 5 GND 4 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. (V) 2.0 0.8 4.4 3.7 0.1 0.4 1.0 20 410 UNIT ...

Page 11

... V (V) CC see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 11 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX ...

Page 12

... PHL PLH output transition time THL TLH AC WAVEFORMS handbook, halfpage For 74HC2G32 50 GND For 74HCT2G32 1 GND to 3 Fig.5 The input (nA, nB) to output (nY) propagation delays and transition times. 2003 Oct 30 TEST CONDITIONS ...

Page 13

... Definitions for test circuit load capacitance including jig and probe capacitance termination resistance should be equal to the output impedance Z T Fig.6 Load circuitry for switching times. 13 Product specification 74HC2G32; 74HCT2G32 open GND MNA742 of the pulse generator. o ...

Page 14

... Oct 2.5 scale (1) ( 0.38 0.18 3.1 3.1 4.1 0.65 0.22 0.08 2.9 2.9 3.9 REFERENCES JEDEC JEITA - - - 14 Product specification 74HC2G32; 74HCT2G32 detail 0.47 0.70 0.5 0.2 0.13 0.1 0.33 0.35 EUROPEAN PROJECTION SOT505 ISSUE DATE 02-01-16 ...

Page 15

... IEC SOT765-1 2003 Oct 2.5 scale (1) ( 0.27 0.23 2.1 2.4 0.5 0.17 0.08 1.9 2.2 REFERENCES JEDEC JEITA MO-187 15 74HC2G32; 74HCT2G32 detail 3.2 0.40 0.21 0.4 0.2 0.13 3.0 0.15 0.19 EUROPEAN PROJECTION Product specification SOT765 (1) ...

Page 16

... To overcome these problems the double-wave soldering method was specifically developed. 2003 Oct 30 74HC2G32; 74HCT2G32 If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave ...

Page 17

... Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2003 Oct 30 (1) not suitable not suitable suitable not recommended not recommended 17 Product specification 74HC2G32; 74HCT2G32 SOLDERING METHOD (2) WAVE REFLOW suitable (3) suitable suitable (4)(5) suitable ...

Page 18

... Product specification 74HC2G32; 74HCT2G32 DEFINITION These products are not Philips Semiconductors ...

Page 19

... Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. ...

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