74hct2g32 NXP Semiconductors, 74hct2g32 Datasheet
74hct2g32
Related parts for 74hct2g32
74hct2g32 Summary of contents
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... DATA SHEET 74HC2G32; 74HCT2G32 Dual 2-input OR gate Product specification Supersedes data of 2002 Jul 17 INTEGRATED CIRCUITS 2003 Oct 30 ...
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... total load switching outputs sum of outputs For 74HC2G32: the condition is V For 74HCT2G32: the condition is V 2003 Oct 30 DESCRIPTION The 74HC2G/HCT2G32 is a high-speed Si-gate CMOS device. The 74HC2G/HCT2G32 provides the dual 2-input OR function. CONDITIONS pF ...
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... PACKAGE 8 TSSOP8 8 TSSOP8 8 VSSOP8 8 VSSOP8 data input 1A data input 1B data output 2Y ground (0 V) data input 2A data input 2B data output 1Y supply voltage 3 Product specification 74HC2G32; 74HCT2G32 OUTPUT MATERIAL CODE MARKING plastic SOT505-2 H32 plastic SOT505-2 T32 plastic SOT765-1 H32 ...
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... MNA Fig.3 IEC logic symbol. 2003 Oct handbook, halfpage handbook, halfpage 3 4 Product specification 74HC2G32; 74HCT2G32 MNA733 Fig.2 Logic symbol MNA166 Fig.4 Logic diagram (one driver). Y ...
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... V + 0.5 V; note < 0 > 0.5 V; note 0.5 V < V < 0.5 V; note note 1 for temperature range from 40 to +125 C; note 2 5 Product specification 74HC2G32; 74HCT2G32 74HCT2G32 MAX. MIN. TYP. MAX. 6.0 4.5 5.0 5 ...
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... I = 4 5 4 5 GND 6 GND; 6 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. UNIT 1.5 1.2 V 3.15 2.4 V 4.2 3.2 V 0.8 0.5 V 2.1 1.35 V 2.8 1.8 V 1.9 2.0 V 4.4 4.5 V 5.9 6.0 V 4.18 4.32 V 5. 0.1 V 0.15 0.26 V 0.16 ...
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... 5 4 5 GND 6 GND; 6 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. UNIT 1.5 V 3.15 V 4.2 V 0.5 V 1.35 V 1.8 V 1.9 V 4.4 V 5.9 V 4.13 V 5.63 V 0.1 V 0.1 V 0.1 V 0.33 V 0. ...
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... 5 4 5 GND 6 GND; 6 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. UNIT 1.5 V 3.15 V 4.2 V 0.5 V 1.35 V 1.8 V 1.9 V 4.4 V 5.9 V 3.7 V 5.2 V 0.1 V 0.1 V 0.1 V 0.4 V 0 ...
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... A 4 4 4 GND 5 GND 4 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. UNIT 2.0 1.6 V 1.2 0.8 V 4.4 4.5 V 4.18 4. 0.1 V 0.15 0.26 V 0.1 A 1.0 A 300 A 2.0 V 0.8 V 4.4 V 4.13 V 0.1 V 0. ...
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... 4 4 4 GND 5 GND 4 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. UNIT 2.0 V 0.8 V 4.4 V 3.7 V 0.1 V 0 410 A ...
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... CC see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 see Figs 5 and 6 2.0 4.5 6.0 11 Product specification 74HC2G32; 74HCT2G32 MIN. TYP. MAX. UNIT ...
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... THL TLH AC WAVEFORMS handbook, halfpage nA, nB input For 74HC2G32 50 GND For 74HCT2G32 1 GND to 3 Fig.5 The input (nA, nB) to output (nY) propagation delays and transition times. 2003 Oct 30 TEST CONDITIONS WAVEFORMS V see Figs 5 and 6 4.5 see Figs 5 and 6 4 ...
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... Definitions for test circuit load capacitance including jig and probe capacitance termination resistance should be equal to the output impedance Z T Fig.6 Load circuitry for switching times. 13 Product specification 74HC2G32; 74HCT2G32 open GND MNA742 of the pulse generator. o ...
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... SOT505-2 2003 Oct 2.5 scale (1) ( 0.38 0.18 3.1 3.1 4.1 0.65 0.22 0.08 2.9 2.9 3.9 REFERENCES JEDEC JEITA - - - 14 Product specification 74HC2G32; 74HCT2G32 detail ( 0.47 0.70 0.5 0.2 0.13 0.1 0.33 0.35 EUROPEAN ISSUE DATE PROJECTION 02-01-16 SOT505 ...
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... Oct detail 2.5 scale (1) ( 0.27 0.23 2.1 2.4 3.2 0.5 0.17 0.08 1.9 2.2 3.0 REFERENCES JEDEC JEITA MO-187 15 Product specification 74HC2G32; 74HCT2G32 0.40 0.21 0.4 0.2 0.13 0.1 0.15 0.19 EUROPEAN ISSUE DATE PROJECTION 02-06-07 SOT765-1 (1) Z 0.4 8 0.1 0 ...
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... To overcome these problems the double-wave soldering method was specifically developed. 2003 Oct 30 74HC2G32; 74HCT2G32 If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave ...
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... Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2003 Oct 30 (1) not suitable not suitable suitable not recommended not recommended 17 Product specification 74HC2G32; 74HCT2G32 SOLDERING METHOD (2) WAVE REFLOW suitable (3) suitable suitable (4)(5) suitable ...
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... Product specification 74HC2G32; 74HCT2G32 DEFINITION These products are not Philips Semiconductors ...
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Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited ...