BDN13-3CB/A01 CTS Thermal Management Products
BDN13-3CB/A01
Manufacturer Part Number
BDN13-3CB/A01
Description
HEATSINK CPU W/ADHESIVE 1.31"SQ
Manufacturer
CTS Thermal Management Products
Series
BDNr
Specifications of BDN13-3CB/A01
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
33.27mm x 33.27mm
Height
0.35" (9mm)
Thermal Resistance @ Forced Air Flow
6.0°C/W @ 400 LFM
Thermal Resistance @ Natural
16.1°C/W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Other names
294-1100