MC14531BCP

Manufacturer Part NumberMC14531BCP
Description12-bit parity tree
ManufacturerMotorola
MC14531BCP datasheet
 


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–A–
16
9
1
8
–T–
N
SEATING
PLANE
E
F
G
D
16 PL
0.25 (0.010)
T
M
–A–
16
9
B
1
8
F
C
S
K
H
G
D
16 PL
0.25 (0.010)
M
MC14531B
4
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–B–
C
L
K
M
J
16 PL
0.25 (0.010)
M
T
B
S
A
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
L
SEATING
–T–
PLANE
M
J
T
A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.750
0.785
19.05
19.93
B
0.240
0.295
6.10
7.49
C
–––
0.200
–––
5.08
D
0.015
0.020
0.39
0.50
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
0.100 BSC
2.54 BSC
H
0.008
0.015
0.21
0.38
K
0.125
0.170
3.18
4.31
L
0.300 BSC
7.62 BSC
_
_
_
_
M
0
15
0
15
N
0.020
0.040
0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
_
_
_
_
M
0
10
0
10
S
0.020
0.040
0.51
1.01
MOTOROLA CMOS LOGIC DATA