BU2725 Philips Semiconductors, BU2725 Datasheet
BU2725
Related parts for BU2725
BU2725 Summary of contents
Page 1
... kHz kHz Csat PIN CONFIGURATION case CONDITIONS average over any 20 ms period ˚C hs CONDITIONS 1 Product specification BU2725AF pulses up to 1700V. TYP. MAX. UNIT - 1700 - 825 - 1.0 7.0 - 5.8 6.5 SYMBOL MIN. MAX. ...
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... CONDITIONS 650 H; C Csat 162 1 B(end Product specification BU2725AF TYP. MAX. UNIT - 3.7 K/W - 2.8 K K/W MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 1 ...
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... VCEOsust . Fig.5. Switching times test circuit. CEOsust ICsat hFE 100 VCE = IBend 0.01 t Fig.6. DC current gain Product specification BU2725AF ICsat IBend t - IBM + 150 v nominal adjust for ICsat Lc LB T.U.T. Cfb BU2727A/AF Ths = 25 C Ths = 85 C 0.1 1 ...
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... Fig.11. Normalised power dissipation BU2727A/ 0.1 Ths = 85 C 0.01 Ths = 25 C 0.001 Fig.12. Transient thermal impedance Product specification BU2725AF BU2527AFX,DFX Fig.10. Limit storage and fall time 85˚ kHz Normalised Power Derating PD% with heatsink compound ...
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... nF 0 B(end) September 1997 VCL 15 10 CFB 5 0 100 Fig.14. Reverse bias safe operating area 0 Product specification BU2725AF BU2727A/AF/D/DF Area where fails occur 1000 1700 VCE / jmax Rev 1.300 ...
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... Fig.15. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 15.3 max 3.1 3.3 7.3 6.2 5.8 3 1.2 1.0 5.45 5.45 6 Product specification BU2725AF 5.2 max 3.2 seating plane 3.5 max not tinned 0.7 max 0.4 M 2.0 Rev 1.300 o 45 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Product specification BU2725AF Rev 1.300 ...