IRF9530N International Rectifier, IRF9530N Datasheet

no-image

IRF9530N

Manufacturer Part Number
IRF9530N
Description
Power MOSFET(Vdss=-100V/ Rds(on)=0.20ohm/ Id=-14A)
Manufacturer
International Rectifier
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF9530N
Manufacturer:
IR
Quantity:
2 265
Part Number:
IRF9530NL
Manufacturer:
IR
Quantity:
12 500
Part Number:
IRF9530NPBF
Manufacturer:
IR
Quantity:
15 600
Part Number:
IRF9530NPBF
Manufacturer:
IR
Quantity:
421
Part Number:
IRF9530NPBF
Manufacturer:
IR
Quantity:
8 000
Part Number:
IRF9530NPBF
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF9530NPBF
0
Company:
Part Number:
IRF9530NPBF
Quantity:
15 000
Company:
Part Number:
IRF9530NPBF
Quantity:
30 000
Part Number:
IRF9530NS
Manufacturer:
IR
Quantity:
834
Part Number:
IRF9530NS
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF9530NSPBF
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF9530NSTR
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRF9530NSTR
Quantity:
23
Part Number:
IRF9530NSTRLPBF
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
IRF9530NSTRLPBF
0
Company:
Part Number:
IRF9530NSTRLPBF
Quantity:
24 000
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts.
resistance and low package cost of the TO-220 contribute
to its wide acceptance throughout the industry.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
D
D
DM
AR
J
STG
D
GS
AS
AR
@ T
@ T
JC
CS
JA
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
P-Channel
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 100°C
= 25°C
on-resistance per silicon area.
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
The low thermal
GS
GS
@ -10V
@ -10V
This
G
Typ.
300 (1.6mm from case )
0.50
–––
–––
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
S
D
Max.
TO-220AB
0.53
-8.4
-5.0
± 20
250
-14
-10
-56
7.9
79
IRF9530N
®
R
Power MOSFET
V
DS(on)
Max.
–––
DSS
1.9
62
I
D
= -14A
PD - 91482C
= -100V
= 0.20
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
5/13/98

Related parts for IRF9530N

IRF9530N Summary of contents

Page 1

... Parameter R Junction-to-Case JC R Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient JA G This The low thermal @ -10V GS @ -10V GS 300 (1.6mm from case ) Typ. 0. 91482C IRF9530N ® HEXFET Power MOSFET -100V DSS R = 0.20 DS(on -14A D S TO-220AB Max. Units -14 -10 A -56 ...

Page 2

... IRF9530N Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... D S Fig 2. Typical Output Characteristics 2.5 -14A 2.0 1.5 1.0 0.5 0.0 A -60 -40 - Junction Temperature ( C) J Fig 4. Normalized On-Resistance Vs. Temperature IRF9530N -4.5V 2 0µ ° -10V 100 120 140 160 180 ° ...

Page 4

... IRF9530N iss iss oss C rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. ...

Page 5

... Duty Factor Fig 10a. Switching Time Test Circuit t d(on 10% 150 175 ° 90 Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 IRF9530N D.U. µ d(off ...

Page 6

... IRF9530N Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G -10V Charge Fig 13a. Basic Gate Charge Waveform 700 600 ...

Page 7

... Fig 14. For P-Channel HEXFETS Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled controlled by Duty Factor "D" SD D.U.T. - Device Under Test P. Period [ V =10V GS Current di/dt Diode Recovery dv/ Forward Drop [ ] IRF9530N + *** ...

Page 8

... IRF9530N Package Outline TO-220AB Outline Dimensions are shown in millimeters (inches) 10 .54 (.4 15) 10 .29 (.4 05) 2.87 (.11 3) 2.62 (. 5.24 (. 4.84 (. 4.09 (. 3. 2.54 (. & ING 4. 82. ...

Related keywords