IRL2910 International Rectifier, IRL2910 Datasheet

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IRL2910

Manufacturer Part Number
IRL2910
Description
HEXFET Power MOSFET
Manufacturer
International Rectifier
Datasheet

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Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts.
resistance and low package cost of the TO-220 contribute
to its wide acceptance throughout the industry.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
D
D
DM
AR
J
STG
D
GS
AS
AR
@ T
@ T
JC
CS
JA
Logic-Level Gate Drive
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 100°C
= 25°C
on-resistance per silicon area.
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
The low thermal
GS
GS
@ 10V
@ 10V
This
G
Typ.
0.50
–––
–––
300 (1.6mm from case )
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
S
D
Max.
200
190
± 16
520
1.3
5.0
TO-220AB
55
39
29
20
Max.
0.75
–––
®
62
R
IRL2910
Power MOSFET
DS(on)
V
DSS
I
D
= 55A
PD - 91375B
= 0.026
= 100V
Units
°C/W
°C/W
°C/W
Units
W/°C
V/ns
mJ
mJ
°C
W
A
V
A
5/13/98

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IRL2910 Summary of contents

Page 1

... Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient JA G This The low thermal @ 10V GS @ 10V GS 300 (1.6mm from case ) Typ. ––– 0.50 ––– 91375B IRL2910 ® HEXFET Power MOSFET 100V DSS R = 0.026 DS(on 55A D S TO-220AB Max. Units ...

Page 2

... IRL2910 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... Fig 2. Typical Output Characteristics 3 2.5 2.0 1.5 1.0 0.5 0.0 A 5.0 5.5 6.0 -60 -40 - Junction T em perature (° Fig 4. Normalized On-Resistance IRL2910 2 0µ ° rain-to-S ource V oltage ( ...

Page 4

... IRL2910 iss iss rss rain-to-S ourc e V oltage ( Fig 5 ...

Page 5

... Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 IRL2910 D.U. µ d(off ...

Page 6

... IRL2910 Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform ...

Page 7

... Voltage Body Diode Inductor Curent Ripple for Logic Level Devices GS Fig 14. For N-Channel HEXFETS Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + + controlled by Duty Factor "D" P. Period V =10V GS di/dt dv/ Forward Drop I SD IRL2910 DD * ...

Page 8

... IRL2910 Package Outline TO-220AB Outline Dimensions are shown in millimeters (inches) 10.54 (.415 ) 10.29 (.405 ) 2.87 (.113 ) 2.62 (.103 ) 15.24 (.600 ) 14.84 (.584 ) 1 14 .09 (. .47 (. .40 (. .15 (. .54 (. ING & TOL 82. ...

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