MC10EP16 ON Semiconductor, MC10EP16 Datasheet
MC10EP16
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MC10EP16 Summary of contents
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... MC10EP16, MC100EP16 3. ECL Differential Receiver/Driver Description The EP16 is a world−class differential receiver/driver. The device is functionally equivalent to the EL16 and LVEL16 devices with higher performance capabilities. With output transition times significantly faster than the EL16 and LVEL16, the EP16 is ideally suited for interfacing with high frequency sources ...
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Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note ...
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Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out I V Sink/Source Operating Temperature ...
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Table 5. 10EP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...
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Table 7. 100EP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 12 Output LOW Voltage (Note 12 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...
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Table 9. 100EP DC CHARACTERISTICS, NECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 18 Output LOW Voltage (Note 18 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...
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FREQUENCY (MHz) ...
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... ORDERING INFORMATION Device MC10EP16D MC10EP16DG MC10EP16DR2 MC10EP16DR2G MC10EP16DT MC10EP16DTG MC10EP16DTR2 MC10EP16DTR2G MC10EP16MNR4 MC10EP16MNR4G MC100EP16D MC100EP16DG MC100EP16DR2 MC100EP16DR2G MC100EP16DT MC100EP16DTG MC100EP16DTR2 MC100EP16DTR2G MC100EP16MNR4 MC100EP16MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...
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... C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004) ...
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K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− SEATING G PLANE PACKAGE DIMENSIONS TSSOP−8 ...
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... AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS DIM MIN MAX A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF b 0.20 0.30 2.00 BSC D D2 1.10 1.30 E 2.00 BSC E2 0.70 0.90 e 0.50 BSC K 0.20 −−− L 0.25 0.35 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10EP16/D ...